ICMEE 2024 - 10th International Conference on Mechanical and Electronics Engineering (ICMEE 2024)
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Website http://www.icmee.org |
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Category Mechanical and Electronics Engineering
Deadline: October 05, 2024 | Date: November 15, 2024-November 17, 2024
Venue/Country: Xi'an, China
Updated: 2023-12-28 15:37:37 (GMT+9)
Call For Papers - CFP
Full Name: 2024 10th International Conference on Mechanical and Electronics Engineering (ICMEE 2024)Abbreviation: ICMEE 2024►Time: November 15-17, 2024►Location: Xi'an, China►Website: www.icmee.org*Proceedings*Submitted papers will be Peer-Reviewed (Double Blind) and the accepted papers will be collected in the conference proceedings.*Committee*Advisory Chairs Rongjun Ding, Hunan University, ChinaXiaohong Guan, Xi'an Jiaotong University, ChinaYang Shi, University of Victoria, CanadaConference Chairs Maode Yan, Changan University, ChinaShengjie Jiao, Changan University, ChinaSong Gao, Xi'an Technological University, ChinaProgram ChairsFei Hui, Changan University, ChinaYisheng An, Changan University, ChinaXuelin Lei, East China University of Science and Technology, ChinaJunfeng Jing, Xi'an Polytechnic University, ChinaFeng Zhao, Xi’an University of Posts & Telecommunications, China Program Co-Chairs Qingchang Lu, Changan University, ChinaZhigang Xu, Changan University, ChinaZhanwen Liu, Chang’an University, ChinaLei Zuo, Chang’an University, ChinaGuowang Gao, Xi’an Shiyou University, ChinaInternational Program CommitteesAndo Ryosuke, Toyota Institute, JapanQiang Meng, National University of Singapore, SingaporeRichard Bucknall, University College London, UKRonghui Liu, University of Leeds, UKAli Mosleh, University of California, USAAsad Khattak, University of Tennessee, USAYinhai Wang, University of Washington, USAStudent Program Chairs Xianwu Gong, Changan University, ChinaLiang Dai, Changan University, ChinaKai Du, Changan University, ChinaLi Li, Changan University, ChinaLiya Zhu, Changan University, ChinaKenan Mu, Changan University, ChinaRegional Chairs Libo Zhao, Xi'an Jiaotong University, ChinaHao Deng, Henan University, ChinaXiaoping Li, University of Electronic Science and Technology of China, ChinaWei Chen, Nanjing University of Science and Technology, ChinaDaiyu Zhang, Jiangsu University of Science and Technology, ChinaPeng Xiao, Sun Yat-sen University, ChinaYuanye Chen, North China Electric Power University, ChinaHaiquan Wang, Zhongyuan University of Technology, ChinaPublicity Committee Tongxing Zheng, Xi'an Jiaotong University, ChinaBin Li, Northwestern Polytechnical University, ChinaFeihu Zhang, Northwestern Polytechnical University, ChinaHuachao Dong, Northwestern Polytechnical University, ChinaShouxu Zhang, Northwestern Polytechnical University, ChinaZhuo Zhang, Northwestern Polytechnical University, ChinaBo Li, Northwestern Polytechnical University, ChinaChaowen Liu, Xi'an University of Posts & Telecommunications, ChinaWei Guo, Xidian University, ChinaXinpeng Fang, Xidian University, China*Topics* (included but not limited to)●Acoustics and Noise Control Marine System Design●Ballistics MEMS and Nano Technology●CAD/CAM/CIM New and Renewable Energy●CFD Noise and Vibration●Composite and Smart Materials Noise Control●HVAC Textile and Leather Technology●Internal Combustion Engines Tribology●Machinery and Machine Design Turbulence●Electrical materials Electromagnetics●High voltage techniques microwave●Power electronics and applications antennas●Mechatronics Communication theory and systems●Control theory and applications Optoelectronics●Robotics and automation systems Biomedical electronics●Intelligent systems Sensors●Electronics instrumentationFor more topics, please visit: http://icmee.org/cfp.html
*Submission Method*1. Online Submission: http://confsys.iconf.org/submission/icmee20242. Send directly to: icmee
academic.net*Contact Us*Secretary: Sara WongEmail: icmeeacademic.netWeb: www.icmee.orgTel: 86-19136375767Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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