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    ICMSET 2024 - 13th International Conference on Material Science and Engineering Technology (ICMSET 2024)

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    Website http://www.icmset.com | Want to Edit it Edit Freely

    Category Material Science and Engineering Technology

    Deadline: October 15, 2024 | Date: November 22, 2024-November 24, 2024

    Venue/Country: Nagoya, Japan

    Updated: 2024-01-18 17:28:03 (GMT+9)

    Call For Papers - CFP

    Full Name: 2024 The 13th International Conference on Material Science and Engineering Technology (ICMSET 2024)

    Abbreviation: ICMSET 2024

    Nagoya, Japan (Nagoya Convention Hall) | November 22-24, 2024

    www.icmset.com

    2024 the 14th International Conference on Material Science and Engineering Technology (ICMSET 2024), will be held in Nagoya, Japan during November 22-24, 2024. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We sincerely welcome the submissions all over the world.

    **Proceedings

    After a careful reviewing process, all accepted papers after proper registration and presentation, will be published by Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752). Indexed by Elsevier: SCOPUS.

    ● ICMSET 2022 - Materials Science Forum(MSF) Vol. 1087, ISBN: 978-3-0357-1838-6 | SCOPUS

    ● ICMSET 2021 - Materials Science Forum(MSF) Vol. 1053, ISBN: 978-3-0357-2684-8 | SCOPUS

    ● ICMSET 2020 - Materials Science Forum(MSF) Vol. 1023, ISBN: 978-3-0357-1784-6 | SCOPUS, Ei Compendex

    ● ICMSET 2019 - Materials Science Forum(MSF) Vol. 998, ISBN: 978-3-0357-1606-1 | SCOPUS, Ei Compendex

    ● ICMSET 2018 - Materials Science Forum(MSF) Vol. 950, ISBN: 978-3-0357-1784-6 | SCOPUS, Ei Compendex

    ● ICMSET 2017 - Materials Science Forum(MSF) Vol. 917, ISBN: 978-3-0357-1213-1 | SCOPUS, Ei Compendex

    ● ICMSET 2016 - Materials Science Forum(MSF) Vol. 890, ISBN: 978-3-0357-1028-1 | SCOPUS, Ei Compendex

    ● ICMSET 2015 - MATEC Web of Conferences Vol. 30, 2015 | SCOPUS, Ei Compendex

    **Organizing Committees

    Conference Chair

    Ramesh K. Agarwal, Washington University in St. Louis, USA

    Program Chairs

    Hideki Aoyama, Keio University, Japan

    Jun Song CHEN, University of Electronic Science and Technology of China, China

    Aleksey Vedyagin, Boreskov Institute of Catalysis SB RAS, Russia

    Publicity Chairs

    Marvin Herrera, University of the Philippines Los Banos, Philippines

    Mohamed Abdel-Hady Gepreel, Egypt-Japan University of Science and Technology, Egypt

    Rinlee Butch Cervera, University of the Philippines Diliman, Philippines

    Carlos Rolando Rios-Soberanis, Centro de Investigación Científica de Yucatán, Mexico

    Bouchaib Zazoum, Prince Mohammad Bin Fahd University, KSA

    **Conference Scopes

    Topics of interest for submission include, but are not limited to:

    Advanced materials

    Biomaterials

    Composite materials

    Energy storage and conversion materials

    Renewable materials

    Functional materials

    Nano materials

    Chemical materials

    3D materials

    Cryogenic materials

    Polymer science

    Smart/Intelligent materials/Intelligent systems

    Optical/Electronic/Magnetic materials

    Automation, control and information technology

    Magnetic materials and smart materials for specific applications

    MEMS and structural control

    Active materials in MEMS applications

    Materials property and characterisation

    For more topics, please visit at http://www.icmset.com/cfp.html

    **Submission

    Abstract and Full Paper submission now is available.

    Link: http://confsys.iconf.org/submission/icmset2024

    (Abstracts are accepted for oral presentation opportunity, not for publication.)

    **Contact us

    Ms. Eliza

    Tel:+852-30717761

    Email: icmsetatsaise.org


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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