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    AEMCSE ) 2024 - [EI Compendex/Scopus ]The 2024 7th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2024)

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    Website http://www.aemcse.org | Want to Edit it Edit Freely

    Category Electronic Materials, Computers and Software Engineering

    Deadline: April 29, 2024 | Date: May 10, 2024-May 12, 2024

    Venue/Country: China

    Updated: 2024-03-27 23:44:38 (GMT+9)

    Call For Papers - CFP

    The 2024 7th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2024)

    Conference date: May 10-12, 2024.

    Conference Venue: Nanchang, China

    Conference website: http://www.aemcse.org

    Introduction

    The 2024 7th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2024) will be held in Nanchang, China on May 10-12, 2024. AEMCSE is proud to host a global gathering of theorists and experts in Advanced Electronic Materials, Computers and Software Engineering in the highly complex field of knowledge and software engineering, which brings researchers, practitioners, and scientists in discussion of the latest methods, research developments, and future opportunities. This event will include the participation of renowned keynote speakers, oral presentations, posters sessions and so on.

    If you do not need to publish any paper, you may attend our conference as oral/poster presenter, or listener. AEMCSE 2024 welcomes submission of researches concerning any branch of Advanced Electronic Materials, Computers and Software Engineering.

    Committee

    Conference General Chair

    Prof. Xiaolin Qiu, Nanchang Institute of Technology, China

    邱小林(理事长),南昌理工学院

    Prof. Wenjun Tan, Northeastern University, China

    覃文军(副院长/教授),东北大学

    Technical Program Committee Chair

    Prof. Guandong Xu, University of Technology Sydney, Australia

    徐贯东(教授),澳大利亚悉尼科技大学

    Organizing Committee Chair

    Prof. YanbinFan, Nanchang Institute of Technology, China

    范彦斌(校长/教授),南昌理工学院

    Publication Chair

    Prof. Lvqing Yang, Xiamen University, China

    杨律青(教授),厦门大学

    Call For Papers

    Advanced Electronic Materials Computers Engineering Software Engineering

    · Optoelectronics and Microelectronic Materials

    · Optoelectronic display materials

    · Semiconductor Materials and Semiconductor Lighting

    · Power Laser Materials and Devices

    · Advanced Packaging Materials and Technologies

    · Solar cell materials

    · Electromagnetic Compatibility Technology and Materials

    · Materials and Devices for High Frequency and Ultra High Frequency Communication

    · Computer Vision

    · Face recognition

    · Image processing

    · Signal processing

    · Communication and wireless networks

    · Optical communication

    · Information Security

    · Computer Networks and Distributed Computing

    · Embedded system

    · Integrated circuit

    · Optoelectronic devices

    Software design method

    · Software testing technology

    · Component-based software engineering

    · Computer-supported collaborative work

    · Programming language

    · Multimedia technology application

    · Embedded software and applications

    · Computer Graphics and Human Machine Interaction

    · Computer Aided Design

    Publication

    All accepted full papers will be published in SPIE - The International Society for Optical Engineering (ISSN: 0277-786X) and will be submitted to EI Compendex / Scopus for indexing.

    Submission

    You can submit your paper (word+pdf) via Electronic Submission System

    中国大陆作者投稿通道:https://www.ais.cn/attendees/paperSubmit/FMV6JN

    Paper Requirements

    1. Please follow the Manuscript template to write:

    http://www.aemcse.org/download

    2.All submissions must not be less than 5 pages and not exceed 10 pages in length.

    3.The article should be original writing that enhances the existing body of knowledge in the given subject area.

    4.Results reported have not been submitted or published elsewhere .

    5. Experiments, statistics, and other analyses are performed to a high technical standard and are described in sufficient detail.

    6.Conclusions are presented in an appropriate fashion and are supported by the data.

    7.The article is presented in an intelligible fashion and is written in Standard English.

    8. Appropriate references to related prior published works must be included.

    Contact

    Ms. Kwok

    Tel: +86-18124944750 (WeChat)

    QQ:2152116918

    E-Mail: AEMCSEat163.com


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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