INTERCON 2011 - INTERCON 2011

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Category INTERCON 2011

Deadline: March 15, 2011 | Date: August 08, 2011-August 13, 2011

Venue/Country: Lima, Peru

Updated: 2011-01-28 17:56:23 (GMT+9)

Call For Papers - CFP

Student Branch has the honor of hosting the biggest event of the IEEE

Section Peru, INTERCON. It is organized by students of this prestigious

university and under the guidance of national and international

professionals.

The Technical Committee invites you to the "XVIII International Congress

of Electrical, Electronic, Systems Engineering" - INTERCON 2011,and has

the honor of presenting the Call For Papers.

The Call For Papers INTERCON 2011 is a great scientific and technology

event. In which students and researchers from Latin America and the world

wide are invited to participate with their innovative researchs related

to (though not restricted to them):

*Electronics

*Microelectronics

*Power

*Computer Systems

*Industrial Applications

*Telecommunications

*Robotics & Automation

*Bioengineering

*Digital Signal Processing

*Education and Technology

*Applications in Electronics.

Important Dates:

* FULL PAPER SUBMISSION TO: 15/03/2011

* NOTIFICATION ACCEPTANCE:04/22/2011

* Responding as notice of attending DEADLINE: 07/23/2011

Presentation format:

The paper presented to INTERCON 2011 should be sent to the following

Email:

callforpapersintercon2011.org

Papers must be submitted in English or Spanish, it should follow the IEEE

format which is published in the website. The maximum number of pates is

8. The papers that will be accepted will be published with ISBN.

Organizer:

IEEE Student Branch of the National Engineering University

www.reieee.uni.edu.pe

Supported:

* National Engineering University in Lima, Peru www.uni.edu.pe * IEEE

Peru section www.ieeeperu.org

For more information about the INTERCON 2011 congress visit our website:

http://www.intercon2011.org