ICETIS 2019 - 2019 4th International Conference on Electronic Technology and Information Science
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Website https://www.keoaeic.org/ICETIS2019 |
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Category Electronic Technology;Information Science
Deadline: January 04, 2019 | Date: February 22, 2019-February 24, 2019
Venue/Country: Shenzhen, China
Updated: 2018-11-09 17:07:38 (GMT+9)
Call For Papers - CFP
About the conference:2019 4th International Conference on Electronic Technology and Information Science (ICETIS 2019) will be held on February 22-24, 2019 in Shenzhen,China. ICETIS 2019 is to bring together innovative academics and industrial experts in the field of electronic technology and information science to a common forum. The primary goal of the conference is to promote research and developmental activities in electronic technology and information science and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in electronic technology and information science and related areas.We warmly invite you to participate in ICETIS 2019 and look forward to seeing you in Shenzhen!PublicationEIPapers submitted to ICETIS 2019 will be reviewed by technical committees of the conference. All accepted full papers will be published by MATEC Web of Conferences(ISSN(Electronic Edition): 2261-236X) and will be submitted to EI Compendex, Scopus and CPCI for indexing.SCISelected 10 papers will be recommended for publication in SCI journal.1)ACM Transactions on the Web (ISSN: 1559-1131), IF=1.5262)Cognitive Systems Research (ISSN: 1389-0417), IF=1.1823)The Computer Journal (ISSN: 0010-4620), IF=0.792*All submissions must not be less than 10 pages in length,and papers should be submitted to ICETIS163.COM , and noted SCI.Call For PapersThe topics of interest for submission include, but are not limited to:I. Electronics Engineering1. 3D Semiconductor Device Technology2. Adaptive Signal Processing3. Advanced Electromagnetics4. Artificial Intelligence5. Component Technology of MEMS6. Compound Semiconductor Physics and Devices7. Computer Engineering8. Device Electronics for I.C9. Electronics System-Level Based Design10. Electronics & Nano Electronics11. Electronics-Medical Electronics12. Epitaxy and Light-emitting Diodes13. Fiber Optics and Fiber Devices14. Giant Area Microelectronics15. Intelligent Transportation Systems16. Integrated Optics17. Medicine and Biology Applications18. Micro/Nano Systems and Networks19. Mixed Signal Circuits20. Mobile Computing21. Mobile Robotics22. Multimedia Services and Technologies23. Networks Design, Protocols and Management24. Optical Electronic Devices & Photonics25. Radio-Frequency Integrated Circuits26. Signal & Image Processing27. VLSI Testing and Design for TestabilityII.Mechanical Engineering28. Mechanical Dynamics and Vibration29. Mechanical Strength30. Mechanical Friction, Wear an.d Lubrication31. Mechanical Design32. Robot Technology and Applications33. Vehicle EngineeringIII. Computer Engineering34. Algorithms35. Artificial Intelligence36. Automated Software Engineering37. Bioinformatics and Scientific Computing38. Computer-aided Design39. Computer Animation40. Computer Architecture41. Computing Ethics42. Computer Modeling43. Computer Networks44. Computer Security45. Computer Simulation46. Database and Data Mining47. Data Compression48. Data Encryption49. Data Mining50. Digital Signal and Image Processing51. Digital System and Logic Design52. Expert Systems53. Image Processing54. Information Systems55. Internet and Web Applications56. Mobile Computing57. Network Security and Cryptography58. Multimedia Applications59. Multimedia Networking60. Mobile Wireless Networks61. Programming Languages62. Wireless Communication63. Wireless Sensor NetworkIV.Other related topics
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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