ICICM 2018 - IEEE--2018 The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)--Ei Compendex and Scopus
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Website http://www.icicm.net/ |
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Category Integrated Circuits;Microsystems;Low-power;RF devices & circuits
Deadline: September 30, 2018 | Date: November 24, 2018-November 26, 2018
Venue/Country: Shanghai, China
Updated: 2018-08-20 17:51:42 (GMT+9)
Call For Papers - CFP
==Publication: IEEE Conference Proceeding==Indexed by: IEEE Xplore, Ei Compendex, and Scopus*==Submission email:icicmyoung.ac.cn (Or you still can submit to the submission system on website)==Find the tempalte with the link:http://www.icicm.net/Template.doc★Keynote Speakers & Invited SpeakersProf. Degang James Chen, IEEE Fellow, Iowa State University, USAProf. Gene Eu (Ching Yuh) Jan,National Taipei University, TaiwanProf. Fei Yuan,Ryerson University,CanadaProf. Zhi-Jian Xie,North Carolina A&T State University, USA★Advisory ChairsProf. Degang James Chen, IEEE Fellow, Iowa State University, USAProf. Meng-Fan (Marvin) CHANG, National Tsing Hua University (NTHU), Taiwan★Conference ChairsProf. Zhigong Wang, Southeast University, ChinaProf. Li Qiang, University of Electronic Science and Technology of China, China★Conference Co-ChairProf. Gene Eu Jan, National Taipei University, Taiwan★Program ChairsProf. Fei Yuan, Ryerson University, CanadaProf. Zhi-Jian Xie, North Carolina A&T State University, USA★Steering Committee ChairProf. Huang Le Tian, University of Electronic Science and Technology of China, China★Technical CommitteeProf. Bo Yan, University of Electronic Science & Technology of China, ChinaProf. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, IndiaProf. Xiaoxiao Wang, BeiHang University, ChinaProf. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, ChinaProf. Jinzhao Wu, Guangxi University for Nationalities, ChinaProf. Shiwei Feng, Beijing University of Technology, ChinaAssoc. Prof. Wei Ni, Hefei University of Technology, ChinaAssoc. Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications, ChinaAssis. Prof. Li Jiang, Shanghai Jiao Tong University, ChinaProf. Jinyan Wang, Peking University, ChinaProf. Zhi-Jian Xie, NC A&T State University, USAProf. S. Ushakumari, College of Engineering Trivandrum, IndiaProf. Lu Tang, Southeast University, ChinaProf. Haizhi Song, University of Electronic Science and Technology of China, ChinaProf. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, ChinaProf. Shiwei Feng, Beijing University of Technology,ChinaFor more members, please visite conference website: http://www.icicm.net/committee.html★★HistoryPapers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3Papers of ICICM2017 can be checked in IEEE Xplore now!Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0★TOPICSDigital, Analog, Mixed Signal IC and SOC design technologySilicon integrated circuits and manufacturingLow-power, RF devices & circuitsIC Computer-Aided –Design technology, DFMSilicon/germanium devices and device physicsInterconnect, Low K, High K and other process technologiesUnconventional and nano-electronicsOrganic semiconductor devices and technologiesCompound semiconductor devices and circuitsDisplays, sensors and MEMSSemiconductor materials and material characterizationPackaging and testing technologySolar cell & other devices for new energy sourcesModeling and simulationEquipment technologyReliabilityDisplays, sensors and MEMSAdvance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)★Support1, Technical Support from IEEE2, support from University of Electronic Science and Technology of China and Southeast University, China★Conference ContactMs Sissi ChanEmail: icicmyoung.ac.cnTel: +86-28-87777577
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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