ICMEE 2020 - IEEE--2020 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2020)--Ei Compendex, Scopus
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Website http://icmee.org/ |
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Category Mechanical;Electronics Engineering
Deadline: March 20, 2020 | Date: May 10, 2020-May 12, 2020
Venue/Country: Osaka, Japan
Updated: 2020-03-09 12:23:31 (GMT+9)
Call For Papers - CFP
IEEE--2020 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2020)--Ei Compendex, Scopus2020 The 6th International Conference on Mechanical and Electronics Engineering is to be held in (Osaka Convention Center, Osaka, Japan) during (May 10-12, 2020)-ICMEE 2020 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.Accepted papers can be published in * ICMEE proceedings* and made available through IEEE Xplore. Proceedings will be submitted for inclusion in leading indexing services, including , etc{ History }The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6 The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6 The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6 The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6 The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31 { Submission Method }1. Send your manuscript directly to conference official email: icmeeoutlook.com 2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2020{ Conference Scope }The works that will be presented and published at conference will focus on, but are not limited to, the following topics:Mechanical EngineeringAcoustics and Noise Control Marine System DesignAerodynamics Material EngineeringApplied Mechanics Material Science and ProcessingAutomation, Mechatronics and Robotics Mechanical DesignAutomobiles Mechanical Power EngineeringAutomotive Engineering MechatronicsBallistics MEMS and Nano TechnologyBiomechanics Multibody DynamicsBiomedical Engineering Nanomaterial EngineeringCAD/CAM/CIM New and Renewable EnergyCFD Noise and VibrationComposite and Smart Materials Noise ControlCompressible Flows Non-destructive EvaluationComputational Mechanics Nonlinear DynamicsComputational Techniques Oil and Gas ExplorationDynamics and Vibration Operations ManagementEnergy Engineering and Management PC guided design and manufactureEngineering Materials Plasticity Mechanics{ Venue }Osaka Convention Center, Osaka, JapanAdd: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN{ Contact }Ms. Serene Loicmeeoutlook.com +86-028-83208181
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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