Our Sponsors
TEMM 2011 - IEEE Workshop on Thermal Modeling and Management: Chips to Data Centers (TEMM 2011)
View: 713
Category TEMM 2011
Deadline: April 25, 2011 | Date: July 25, 2011
Venue/Country: Florida, U.S.A
Updated: 2011-03-29 13:47:10 (GMT+9)
Call For Papers - CFP
TEMM 2011 is the first of an upcoming series of workshops, sponsored by IEEE, exploring the state-of-the-art and the new developments in the fields of thermal modeling and management, spanning a wide spectrum from chip-level to data center-level approaches. TEMM'11 takes place in Orlando, FL (Holiday Inn at Disneyworld) on July 25th, 2011, in conjunction with the International Green Computing Conference (IGCC) 2011.http://www.bu.edu/peaclab/temm11
The purpose of TEMM is to provide a forum for exchanging ideas and demonstrating research results in temperature modeling and management at various levels of computing, including chip-level solutions, algorithms, applications and software, operating systems, middleware, and techniques for data centers. We also welcome papers focusing on thermal modeling and management of emerging technologies such as 3D stacked architectures and hybrid systems.Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.