Our Sponsors
HOTI 2011 - 2011 IEEE 19th Annual Symposium on High-Performance Interconnects (HOTI)
Website www.hoti.org |
Edit Freely
Category HOTI 2011
Deadline: April 30, 2011 | Date: August 24, 2011-August 26, 2011
Venue/Country: Santa Clara, U.S.A
Updated: 2011-04-10 20:05:24 (GMT+9)
Call For Papers - CFP
Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, data centers, and cloud facilities. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field. This yearly conference is very well attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field. Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. In addition to those subscribing to the main theme of the conference, contributions are also solicited in the topics listed below. The best papers of Hot Interconnects 2011 will be published in a special issue of IEEE Micro. Building on last year's successful technical program, keynotes, sessions, and panels on datacenter networking and their requirements, and solutions, in 2011 Hot Interconnects moves to the Intel World Headquarters, Santa Clara, CA for the conference. This year's conference focusses on data-center, virtualized, and cloud networking. We hope you can join us there. Download a copy of the CFP here. ThemesNovel and innovative interconnect architecturesMulti-core processor interconnectsSystem-on-Chip InterconnectsAdvanced chip-to-chip communication technologiesOptical interconnectsProtocol and interfaces for inter-processor communicationSurvivability and fault-tolerance of interconnectsHigh-speed packet processing engines and network processorsSystem and storage area network architectures and protocolsHigh-performance host-network interface architecturesHigh-bandwidth and low-latency I/OTb/s switching and routing technologiesInnovative architectures for supporting collective communicationNovel communication architectures to support grid computingCentralized and distributed cloud interconnectsRequirements driving high-performance interconnectsTraffic characterization for HPC systems and commercial data centersSubmission GuidelinesSubmission deadline: April 30, 2011Notification of acceptance: June 11, 2011Papers need sufficient technical detail to judge quality and suitability for presentation. Paper limit: 8 pages, two columnsSubmit title, author, abstract, and full paper (8 pages, double-column, IEEE format)Papers should be submitted electronically through EasyChair: https://www.easychair.org/conferences/?conf=hoti2011
About the conferenceConference held on August 24-25 2011 at Intel World Headquarters, Santa Clara, CAPapers selected will be published in proceedings by the IEEE Computer SocietyPresentations are 30-minute talks in a single-track formatOnline information at http://www.hoti.orgKeywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.