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    ISSM 2011 - International Symposium on Semiconductor Manufacturing ( ISSM)

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    Website www.tsia.org.tw/Seminar/eManufacturing/2011/ | Want to Edit it Edit Freely

    Category ISSM 2011

    Deadline: June 01, 2011 | Date: September 05, 2011-September 07, 2011

    Venue/Country: Hsinchu, Taiwan

    Updated: 2011-04-20 22:57:28 (GMT+9)

    Call For Papers - CFP

    In collaboration with ISSM, this joint Symposium attends to recent technological advancements to align the needs of designers, manufacturers, equipment suppliers, software vendors, solution providers and researchers. It offers a public arena for the exchange of up-to-date experiences among manufacturers for adoption of technological developments. With green notions of supply/engineering/value chains, coverage of the joint symposium includes, but not limited to, the following topics of interests:

    Advanced Lithography

    Benefits and Justification (ROI, CoO, OEE ...)

    Contamination Control and Ultraclean Technology

    Control Architecture/Engineering/IT Infrastructure

    Cross-industrial Applications of PV/SSL/FPD/…

    Data Collection/Quality/Storage/Management

    Design for Manufacturing/Testing/Yield

    e-Diagnostics, e-Manufacturing, and EEC

    Engineering/Supply/Value Chains

    Environment, Safety and Health

    Equipment Control/Integration

    Fab Management/Scheduling/Dispatching

    Factory Design & Automated Material Handling

    Factory Integration/Operations

    Factory Physics & Queueing Operations

    Fault Detection/Classification and Sensors

    Final/Lean/Green Manufacturing

    Manufacturing Control and Execution Systems

    Manufacturing Strategy and Operation Management

    Next Generation Factory & 450mm Wafers

    Predictive/Preventive Maintenance

    Process and Material Optimization

    Process and Metrology Equipment

    Process Control and Monitoring

    Process Modeling and Model-Based Simulations

    Process/Tool/Sensor Integrations

    Standards (Equipment, Communications, …)

    Through Silicon Via & 3D Structures

    Ultra High Productivity in High-Volume Manufacturing

    Yield Enhancement and WIP Management

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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