IEEE NIVI09 2009 - IEEE Workshop on Networking Intelligent Vehicles and Infrastructures (IEEE NiVi09)

Website http://snac.eas.asu.edu/workshop/NIVI09 | Edit Freely

Category IEEE NIVI09 2009

Deadline: June 22, 2009 | Date: November 30, 2009

Venue/Country: Hawaii, U.S.A

Updated: 2010-06-04 19:32:22 (GMT+9)

Call For Papers - CFP

http://snac.eas.asu.edu/workshop/NIVI09

Co-located with IEEE GLOBECOM 2009

Honolulu, Hawaii, USA

Call for Papers

Car-to-car (C2C) communication networks have now gain popularity and importance. New technical challenges have evolved that demand research and investigations. Globally, automobiles are indispensable for connecting people, delivering goods and services and commuting from one place to another. Car industries are of great importance in Asia, Europe, USA and the rest of the world. Car markers will be key players in car telematics. Much research remain to be done to bring alive the vision of future intelligent inter-vehicular applications, which will be supported by C2C.

This workshop is intended to serve as a forum and bring together the researchers and engineers in both academia and industry to exchange ideas, share experiences, and report original works about all aspects of service discovery and composition in ubiquitous and pervasive environments. The main purpose is to promote discussions of research and relevant activities in the design of architectures, algorithms, and applications for inter-vehicular communication environments. This workshop will also address some leading standardization efforts (802.11p, p1609, TIA TR48, etc.).

Technical research papers are solicited in the following areas:

ITS car-2-car networks

ITS car-2-roadside communications

MAC, routing, QoS, addressing, multicast, TCP protocols

Congestion Control and Cooperative VANETs

New application scenarios of ITS vehicular networks

Mobility and handoff issues

Sensors & Data Collection

Content Distribution

C2C communications

Intra-car communications

Traffic and flow control issues

Info Dissemination; Data organization

Security issues, architectures and solutions

Privacy issues and solutions

Data replication protocols in network partitions

Different technologies (DSRC, WiMAX, WiFi, 3G/4G, cell phone)

Application innovation

802.11p WAVE ; 802.11s MESH; DSRC

Implementation/deployment status

Standardization issues for C2C

Important Dates:

Paper Submission Deadline: 15 June 2009

Acceptance Notification: 1 August 2009

Camera-Ready Papers: 1 September 2009

Paper Submissions:

Paper submissions have to be made online at EDAS http://edas.info/N7797 in accordance with the submission procedures of IEEE GlobeCom. All submitted papers will be peer-reviewed.Accepted papers will be published in the IEEE Xplore. Further enquires can be directed to the TPC Chair and Vice Chairs.

Organizing Committee:

General Co-Chairs:

Russell Hsing, Telcordia Technologies USA

Daniel Wong, 3G Wireless & Software, MALAYSIA

C K Toh, Univ. of Hong Kong, CHINA

Technical Program Committee Chair:

Hong Cheng, Telcordia Technologies, USA

Technical Program Committee Vice Chairs:

Li-Der Chou, National Central University, TAIWAN

Dijiang Huang, Arizona State Univ., USA

Michele Weigle, Old Dominion Univ., USA

Publicity Chair:

Wang Xin, Fudan Univ., CHINA

Publications Chair:

K C Leung, Univ. of Hong Kong, CHINA

Technical Program Committee Members (Tentative):

Dr. Onur Altintas, Toyota, USA

Dr. Fan Bai, GM R&D USA

Prof. Juan-Carlos Cano, Technical University of Valencia, SPAIN

Prof. Georg Carle, Technical University Munchen, GERMANY

Dr. Chungmin Chen, TARC-TW, TAIWAN

Prof. Yacine Doudane, LRSM Evry, Cedex FRANCE

Prof. Jonsson Erland, Chalmers U of Tech, SWEDEN

Dr. Andreas Festag, NEC, GERMANY

Dr. M. Fujise, NICT, JAPAN

Dr. Carolina Gilberga, Telefonica, SPAIN

Prof. Marco Gruteser, Rutgers University, USA

Prof. Hannes Hartenstein, University of Karlsruhe, GERMANY

Prof. Teruo Higashino, Osaka University, JAPAN

Prof. E Hossain, Manitoba University, CANADA

Prof. Y M Jang, Kookmin University, KOREA

Prof. D K Kim, Kyungpook National University, KOREA

Dr. Hang Liu, Thomson, USA

Prof. Pascal Lorenz, University of Haute Alsace, FRANCE

Prof. Michael Lyu, Chinese University of Hong Kong, CHINA

Prof. Mario Marchese, ITALY

Prof. Pietro Manzoni, Universi Politecnica De Valencia, SPAIN

Dr. Marc Necker, U of Stuttgart, GERMANY

Dr. Jarek Rykowski, Poznan University of Economics, POLAND

Dr. Junyi Wang, NICT, JAPAN

Dr. Christian Weiss, Daimler, GERMANY

Prof. Weidong Xiang, U of Michigan, USA

Dr. Wang Xin, Fudan University, CHINA

Dr. Kun Yang, Essex University, UK

Prof. Liuqing Yang, U of Florida, USA

Prof. Fei Richard Yu, Carleton University, CANADA

Dr. Tao Zhang, Telcordia, USA