Sign for Notice Everyday    Sign Up| Sign In| Link| English|

Our Sponsors


    JECE 2012 - Special Issue on Energy and Thermal Management of Embedded Computing

    View: 2176

    Website | Want to Edit it Edit Freely

    Category JECE 2012

    Deadline: August 15, 2011 | Date: January 15, 2012

    Venue/Country: Call for Papers, U.S.A

    Updated: 2011-07-17 17:20:03 (GMT+9)

    Call For Papers - CFP

    Journal of Electrical and Computer Engineering

    Special Issue on Energy and Thermal Management of Embedded Computing

    (Link: http://www.hindawi.com/journals/jece/si/etm/)

    Call for Papers

    Excessive energy dissipation has become one of the limiting

    factors for the sustained growth of today’s embedded

    computing technology. High power consumption and

    power density reduce system reliability, increase energy

    as well as cooling cost, and cut the battery lifetime

    of mobile devices. Runtime energy/thermal management

    dynamically consolidates workload of computers, adjusts the

    power/performance mode of devices, and finds tradeoffs

    between quality of services (QoS) and energy dissipation.

    Those runtime management actions usually bring significant

    performance and energy overhead and should be chosen

    carefully with the consideration of the hardware and software

    environments, the user activities and QoS requirements, the

    battery efficiency, the communication protocols, and the

    routing algorithms. The main goal of this special issue is to

    provide a forum for the researchers to share the most recent

    developments and ideas on energy/thermal management in

    various areas of embedded computing, from application,

    OS, and middleware development to communication and

    network optimization.We also welcome contributions focusing

    on energy/thermal management of embedded systems

    powered by novel energy sources or utilizing innovative

    energy storage techniques.

    The topics to be covered include,but are not limited to:

    ? Energy-/temperature-aware algorithm design

    ? Runtime power/energy/thermal management

    ? Energy/thermal analysis or optimization in various

    computing and communication layers

    ? Energy-aware operating system kernels and modules

    ? Energy/thermal modeling and simulation

    ? Energy-/temperature-aware distributed computing

    ? Ultralow energy design space-sub/near threshold computing

    in embedded systems

    ? Design and optimization of embedded systems based

    on renewable energy

    ? Battery-aware optimization of computing and communication

    ? Co-optimization of cooling power and computation/

    communication power

    ? Network infrastructures for enhanced energy/thermal

    management

    ? Energy-aware multicore architectures

    ? Context-aware energy/thermal management of

    embedded computing

    ? Energy footprinting of embedded computing systems

    ? Energy/thermal workload/benchmark analysis and

    characterization

    ? Experiences, case studies, and lessons learned for

    energy-/temperature-aware embedded computing

    applications

    Before submission authors should carefully read over the

    journal’s Author Guidelines, which are located at

    http://www.hindawi.com/journals/jece/guidelines/.

    Prospective authors should submit an electronic copy of

    their complete manuscript through the journal Manuscript

    Tracking System at http://mts.hindawi.com/ according to

    the following timetable:

    Manuscript Due August 15, 2011 (Extended)

    First Round of Reviews October 15, 2011

    Publication Date January 15, 2012

    Lead Guest Editor

    Qinru Qiu, Department of Electrical and Computer Engineering,

    Binghamton University,

    Binghamton, NY, 13902, USA;

    qqiuatbinghamton.edu

    Guest Editors

    Ayse Kivilcim Coskun, Department of Electrical and Computer Engineering,

    Boston University,

    Boston, MA, 02215, USA;

    acoskunatbu.edu

    Dhireesha Kudithipudi, Department of Computer Engineering,

    Rochester Institute of Technology,

    Rochester, NY 14623, USA;

    dxkeecatrit.edu

    Song Ci, Department of Computer and Electronics Engineering,

    University of Nebraska-Lincoln,

    200B PeterKiewit Institute,

    Omaha, NE 68182, USA;

    sciatengr.unl.edu


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.