CUMTEL 2009 - International Workshop on CUMTEL (Classroom, Mobile and Ubiquitous Technologies Enhanced Learning)
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Website www.icce2009.ied.edu.hk |
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Category CUMTEL 2009
Deadline: August 17, 2009 | Date: November 30, 2009
Venue/Country: HongKong, Hong Kong
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
International Workshop on CUMTEL (Classroom, Mobile and Ubiquitous Technologies Enhanced Learning) at ICCE 2009 in Hong Kong, on November 30 or December 1, 2009.Conference web page: http://www.icce2009.ied.edu.hk/
1. A brief description of the workshop topic Increasingly, technology enhanced learning (or TEL) scenarios are conceived in an integrated perspective beyond certain pieces of software running on single computers and also beyond web-based learning environments for single users. New ideas are centered around combining different software tools, web resources and also new peripherals (non standard hardware such as smart objects and mobile devices) in a way that improves \"educational workflows\", avoiding discontinuities in the learning processes and in the creation, transformation, aggregation and re-use of learning objects. Classroom, Mobile and Ubiquitous Technologies Enhanced Learning (CUMTEL) are the concrete manifestation of this trend. The potential prevalence of CUMTEL suggests that, in the forthcoming years, there will be a considerable adoption effort of technological innovations in educational practices. The aim of this work is to provide a forum where international participants can share knowledge on the latest developments in CUMTEL and map out directions for future developments and research collaborations. The series of CUMTEL, the former name was MULE (Mobile and Ubiquitous Learning Environments), workshops started in Beijing, China, December, 2006, at ICCE2006 and the 2nd workshop was held in Hong Kong, August 2007. The 3rd workshop took place in Hiroshima Japan, in November 2007 at ICCE2007 and the 4th workshop was a doctoral student consortium in Taiwan at ICCE2008 in October 2008. CUMTEL 2009 was held in Tokushima, March 26-28, 2009. This will be the 6th workshop on CUMTEL. Basic themes and topics:ï?? . Extending awareness and contextualisation in CUMTELï?? . Integration of CUMTEL into broader teaching/learning processes ï?? . Intelligent support for CUMTEL (user modelling, profiling, ...)ï?? . Artificial agents or robots in CUMTEL (architectures, examples, techniques, ...)ï?? . Game design in CUMTELï?? . Emotional design and motivational support in CUMTELï?? . Domain specific applications (e.g., language learning, mathematics)ï?? . Experimental usage and evaluation of CUMTELï?? . Theories of mobile and ubiquitous learning3. Organizers / proposersHiroyuki Tarumi, Kagawa University (Japan)Makiko Takenaka, Oita University (Japan)Hiroaki Ogata, University of Tokushima (Japan)4. Program Committee membersNelson BALOIAN, Universidad de Chile, ChileYoshiaki HADA, Open University, JapanGwo-Jen Hwang, National University of Tainan, Taiwan KINSHUK, Athabasca University, CanadaSiu Cheung KONG, Hong Kong Institute of Education, Hong KongChen-Chung LIU, National Central University, TaiwanMarcelo MILRAD, Vaxjo University, SwedenYusuke MORITA, Waseda University, JapanMike SHARPLES, University of Nottingham, UKJu-Ling SHIH, National University of Tainan, TaiwanYao-Tin SUNG, Normal University, TaiwanJie-Chi YANG, National Central University, TaiwanStephen YANG, National Central University, TaiwanChengjiu YIN, Kyushu University, Japan5. We expect more than 10 presentations, and more than 20 participants in a half-day workshop.6. Important datesJuly 31, 2009: Submission deadline for workshop paper August 17, 2009: Acceptance notification of workshop paper August 31, 2009: Final version deadline for workshop paper7. Paper formatThe maximum page length is 5 pages and the format follows the template in Author Guidelines of ICCE 2009 (http://www.icce2009.ied.edu.hk/cfp_author_guid.html
).8. Paper submissionPlease send a submission to cumtelWS
gmail.com before July 31, 2009.
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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