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    INA-OCMC 2012 - 6th International Workshop on Interconnection Network Architectures: On-Chip, Multi-Chip (INA-OCMC)

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    Category INA-OCMC 2012

    Deadline: October 14, 2011 | Date: January 23, 2012-January 25, 2012

    Venue/Country: Paris, France

    Updated: 2011-10-08 09:03:42 (GMT+9)

    Call For Papers - CFP

    CALL FOR PAPERS

    6th International Workshop on

    Interconnection Network Architectures: On-Chip, Multi-Chip (INA-OCMC)

    (http://mpsoc.unife.it/~inaocmc)

    Held in conjunction with

    the 7th International Conference on High Performance Embedded Architectures

    and Compilers (HiPEAC) (http://www.hipeac.net/conference)

    in Paris, France, January 23-25, 2012

    Organizers:

    General Chairs

    - Davide Bertozzi, University of Ferrara, Italy

    - Tor Skeie, Simula Research Labs, Norway

    Program Chairs

    - Cyriel Mickenberg, IBM Zurich, Switzerland

    - Giorgos Dimitrakopoulos, Univ. of West Macedonia, Greece

    Publications Chair

    - Alessandro Strano, University of Ferrara, Italy

    Publicity Chair

    - Gaspar Mora, Intel, USA

    Special Session Chair

    - Maurizio Palesi, Kore University, Italy

    Steering Committe

    - Jose Duato, Techn. University of Valencia, Spain

    - Manolis Katevenis, FORTH-ICS, Greece

    When interconnecting different end-nodes in both on-chip and multi-chip

    processing architectures, the communication infrastructure plays a dominant

    role in determining overall system metrics such as performance, reliability

    and often even area and power. On the other hand, each application domain

    poses its own design constraints that the interconnect fabric has to cope

    with, thus leading to well differentiated architecture design principles.

    Ultimately, careful engineering of the interconnection network is at the core

    of the successful development of both on-chip and multi-chip processing

    architectures.

    Original papers describing new and previously unpublished results are

    solicited on all aspects of interconnection network architectures.

    Topics of interest include but are not limited to:

    * Networks-on-Chip (NoC)

    * Multi-Chip Interconn. Networks, including Cluster Interconnects

    * "Commodity Switches" as general-purpose building blocks

    * Switching, buffering, and routing architectures

    * Flow control and congestion management in switching fabrics

    * Virtualization

    * Topology exploration

    * Timing, synchronous/asynchronous communication

    * Reliability, availability, fault tolerance

    * Area/power versus functionality/QoS support in NoC architectures

    * Design space exploration

    * NoC physical link design

    * NoC testing and verification

    * Programming models for NoC-centric systems

    Submissions from EU projects in progress as well as seminal work and new ideas

    to stimulate advances in the field are also encouraged. The program committee

    recognizes that such papers may contain fewer experimental results than papers

    in established areas.

    Paper submission:

    Electronic paper submission requires a full paper, up to 4 double-column

    ACM format pages, including figures and references. Please use the following

    template when preparing your manuscript:

    http://www.acm.org/sigs/publications/proceedings-templates

    Papers should include title, authors and affiliation. The work will be

    evaluated by the program committee based on scientific merit, innovation,

    relevance, and presentation. The submission procedure will be through the

    EasyChair web-page (https://www.easychair.org/conferences/?conf=inaocmc2012)

    Accepted papers will be published in the ACM digital library.

    Important dates:

    Submission deadline: October 14th, 2011.

    Notification of acceptance: November 15th, 2011.

    Workshop: January 22nd, 2012

    Technical Program Committee:

    - Federico Silla, UPV, Spain

    - Sudhakar Yalamanchili, Georgia Tech, USA

    - Federico Angiolini, iNOCS, Switzerland

    - Maurizio Palesi, Kore University, Italy

    - Eitan Zahavi, Mellanox, Israel

    - Janusz Kleban, Poznan University of Technology, Polland

    - Kees Goosens, TUE, Netherlands

    - Marcello Coppola, ST, France

    - Pedro Javier Garcia, UCLM, Spain

    - Jose Angel Gregorio Monasterio, Univ. of Cantabria, Spain

    - Jose Luis Sanchez Garcia, UCLM, Spain

    - Partha Kundu, Juniper Networks, USA

    - Paco Gilabert, UPV, Spain

    - Vassos Soteriou, CUT, Cyprus

    - Natalie Enright Jerger, Univ. of Toronto, Canada

    - Paul Ampadu, Univ. of Rochester, USA

    - Steven Nowick, Columbia University, USA

    - David Atienza, EPFL, Switzerland

    - Nikos Chrysos, IBM Research Zurich, Switzerland

    - Soeren Sonntag, Intel Mobile Communications, Germany

    - Jaan Raik, Tallin University of Technology, Estonia

    - Hiroki Matsutani, Keio University, Japan

    - Pascal Vivet, CEA, France

    - Ulrich Bruening, Univ. of Heidelberg, Germany

    - Sven Arne Reinemo, Simula, Norway


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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