CII 2013 2013 IEEE Symposium on Computational Intelligence in Industry

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Deadline: October 10, 2012 | Date: April 16, 2013-April 19, 2013

Venue/Country: Singapore, Singapore

Updated: 2011-08-26 17:54:01 (GMT+9)

Call For Papers - CFP

2013 IEEE Symposium on Computational Intelligence in Industry

Computational Intelligence (CI) techniques have been widely and successfully applied to solve a variety of real-world problems in industry and defense. Nevertheless, several practical reasons do exist that prevent engineers from adopting most advanced CI techniques in their daily work. The main motivation of this symposium is to promote and strengthen the connections between academia, industry and government agencies through providing easily comprehensible tutorials, presenting successful application examples in industry and brain-storming discussions on how to make CI techniques to accessible to engineering and practitioners.

Topics

Topics of the symposium include, but are not limited to:

Industry-related research and development using CI techniques

Application of CI techniques for solving complex real-world problems in industry

Results from industry-financed CI research projects

Results from industry-led or industry-participated projects financed by government agencies and / or industry

Technology transfer issues

Assessment of the technology maturity level, e.g., using standards such as the Technology Readiness Levels (TRL’s) source: http://www.sei.cmu.edu/pub/documents/02.reports/pdf/02sr027.pdf

Analysis of CI related IP landscape

Best practices

Integration of CI with traditional technologies

Communication between industry, academia and government

Large CI research groups in industry

Guidelines and research opportunities at NSF and other government agencies

Large application-oriented CI research groups at academia

IEEE CIS supported activities that promote CI applications, including establishing CI related MSc program and summer schools

Software and methodologies that enhance the accessibility of engineers to CI techniques

User-friendly software for application CI techniques

Training programs on CI related techniques

CI models lifecycle support: How do you support deployed CI models over time to prevent obsolescence? How do we enable others (maybe IT technicians) to do it?

Call for Keynote, Tutorial and Panel Session Proposals

Please forward your proposals with detailed abstract and bio-sketches of the speakers to Symposium Co-Chairs and SSCI Keynote-Tutorial Chair, Dr S. Das.

Call for Special Session Proposals

Please forward your special session proposals to Symposium Co-Chairs.

Symposium Co-Chairs

Piero P. Bonissone, GE Global Research, USA

Keeley Crockett, UK

Cristian Figueroa, Chile

Program Committee (Provisional)

Angelov Plamen, Lancaster University, UK

Tao Ban, National Institute of Information and Communications Technology, Japan

Piero Bonissone, General Electric Global Research, USA

Pei-Chann Chang, Yuan Ze University, Taiwan, ROC

Carlos A. Coello Coello, CINVESTAV-IPN, Mexico

Fahmida N. Chowdhury, National Science Foundation, USA

Dimitar P. Filev, Ford Research & Advanced Engineering, Dearborn, USA

Gary Fogel, Natural Selection Inc., USA

Michael Gienger, Honda Research Institute Europe, Germany

Chi Keong Goh, Rolls-Royce Singapore Pte Ltd, Singapore

Anthony (Tony) J. Grichnik, Caterpillar Inc., USA

Robert Golan, DBmind Technologies Inc, USA

Hani Hagras, University of Essex, UK

Moufid Harb, Larus Technologies, Canada

Xiao Hu, General Electronic Global Research, USA

Yaochu Jin, Honda Research Institute, Germany

Bob John, De Montfort University, UK

Graham Kendall, University of Nottingham, UK

Nikola Kasabov, Auckland University of Technology, New Zealand

Arthur Kordon, Dow Chemical Company, USA

Xuelong Li, Birkbeck College, University of London, UK

Yan Liu, Motorola Labs, USA

Zbigniew Michalewicz, University of Adelaide, Australia

Luis Magdalena, European Centre for Soft Computing, Spain

Yan Meng, Stevens Institute of Technology, USA

Yi Lu Murphey, The University of Michigan-Dearborn, USA

Hiroshi Nakajima, OMRON Corporation, Japan

Detlef D Nauck, BT Innovate & Design, UK

Tatsuya Okabe, Honda R&D, Japan

Yew Soon Ong, Nanyang Technological University, Singapore

Thomas E. Potok, Oak Ridge National Laboratory, USA

Danil Prokhorov, Toyota Research Institute NA, USA

Tapabrata Ray, University of New South Wales, Australia

Thomas Runkler, Siemens AG, Germany

Qiang Shen, Aberystwyth University, UK

Jennie Si, Arizona State Uniersity, USA

Joachim Sprave, Daimler AG, Germany

Ke Tang, University of Science and Technology of China, China

Hideyuki Takagi, Kyushu University, Japan

Chuan-Kang Ting, National Chung Cheng University, Taiwan

Vincenzo Loia, University of Salerno, Italy

Dianhui (Justin) Wang, La Trobe University, Australia

Slawo Wesolkowski, DRDC CORA, Canada

Feng (Fred) Xue, General Electric Global Research, USA

Ali M.S. Zalzala, Hikma Group Limited, UAE

Qi Zhang, Tama University, Japan

Yilu Zhang, General Motor Company, USA