OEMA 2012 - 2nd International Conference on Optical, Electronic Materials and Applications (OEMA 2012)
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Website www.theiast.org/oema2012 |
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Category OEMA 2012
Deadline: September 01, 2011 | Date: March 04, 2012-March 06, 2012
Venue/Country: Chongqing, China
Updated: 2011-09-15 16:17:15 (GMT+9)
Call For Papers - CFP
Saturable optical amplifiers and absorbers Novel photonic materials and devices Heterogeneous material growth III-V compound semiconductor epitaxy Self-assembled and patterned nano-structured material growth Semiconductor nanostructures growth Metamaterials, including plasmonic structures Materials and engineered structures for light control Photonic crystals Nano-photonics including nano-patterning-fabrication-device Photonic devices and integration Microwave and Terahertz photonics Modeling and simulation of materials and devices2. Optical Materials and DevicesMaterials synthesis, nanomaterials, ceramics and crystal growth Disordered and amorphous materials Hybrid optical materials (organic/inorganic) Characterization techniques of optical materials Physical properties of optical materials Luminescence mechanisms and energy transfers Control of impurities, defects, traps Novel concepts: methods, phenomena and materials Optical functional materials and their applicationsMicrostructured optical fibers Nano fibers Gratings and grating-based devices Plasmonic sensors Acousto-optic devices Optical fiber amplifiers and fiber lasers Non-linear and polarization effects in fibers Fiber measurement techniques Splices, connectors, and fiber coupling Silicon photonics and polymer waveguides Device packaging, testing and reliability3. NEMS/MEMS Materials and DevicesMaterials and Device Characterization Fabrication Technologies Packaging and Assembly Technology Mechanical and Physical Sensors Chemical Sensors and Microsystems BioMEMS and Fluidic Systems Actuators and micro-structure modeling Optical MEMS and nanophotonic (PBG, QD and plasmonics) RF MEMS devices and switching circuits Sensing System, Algorithm and Sensor Networks Nanotechnology and NEMS Devices Lab-on-a-chip and uTAS devices Plasmonic MEMS and devices4. Electronic Materials and InstrumentsIssues for Wide Bandgap Materials Nanoscale Science and Technology in Materials Green MaterialsMicroelectronic Materials & ProcessesPolymer Materials & Microelectronic ApplicationsThick & Thin Film MaterialsChip-Scale Packaging/Flip ChipHigh Density PackagingWafer Scale PackagingWireless Sensor Packaging & ApplicationsPackaging Technologies for optoelectronicsLow Cost Packaging MethodsWafer Fabrication TechnologiesInterconnection TechnologiesElectrical Modeling & Signal IntegrityHigh Density DisplaysMechanical Modeling and Structural IntegrityThermal Design, Analysis, and CharacterizationOptoelectronics/Photonics5. Modeling, Simulation and ApplicationsMicro and Macro Level ModelingVibration and Acoustic ControlPassive/Semi-Active/Active Damping and Stiffness VariationActuation and Motion ControlIntelligent and Adaptive ControlModeling Simulation and Control of Micro/Nano SystemsNonlinear Dynamics, Nonlinear VibrationVirtual Manufacturing and Networked ManufacturingDesign in Collaborative and Distributed EnvironmentsVirtual DesignCAD, CAM, CAESmart and Intelligent Sensor and its ApplicationActuators and SensorsIndustrial Applications (Aerospace, Automotive, Energy, and others)Military ApplicationsDevices and Integrated systemsDesign Methodologies and ToolsPower and Control ElectronicsMorphingGovernment Smart ProductsGray system and Cloud Computing Cognitive Radio and Computer VisionPattern Recognition and Machine LearningFuzzy System and Fuzzy ControlKnowledge Management and Knowledge EngineeringManagement Information SystemsData Mining & Knowledge DiscoveryE-service IntelligenceVideo & Image ProcessingWireless Communication SystemsWireless NetworksIntelligent ControlProcess AutomationElectric AutomationSystem Theory and Control TheorySystem Modeling and SimulationIntelligent Mechatronics and RoboticsITS and Traffic ControlComputer Integrated Manufacturing SystemsHuman-Computer InteractionIntelligent Sensor and Sensor NewworkInformation Processing and Information SecurityInformation RetrievalDatabase Engineering and SystemIntelligent Traditional Chinese Medicine SystemsIntelligent Systems for EducationsOther Applicatio
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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