ICKEM 2012 - 2012 2nd International Conference on Key Engineering Materials

Website http://www.ickem.org/ | Edit Freely

Category Key Engineering Materials

Deadline: December 25, 2011 | Date: February 26, 2012-February 28, 2012

Venue/Country: Singapore, Singapore

Updated: 2011-11-29 17:48:15 (GMT+9)

Call For Papers - CFP

2012 2nd International Conference on Key Engineering Materials (ICKEM 2012) is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Key Engineering Materials. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:

Advanced Characterization

Biological Materials

Biotechnology and Life Sciences

Bulk Crystal Growth

Characterization

Computational Materials Science

Corrosion and Environmental Effects

Defects

Devices

Economics of Materials

Electrochemistry

Electronic Materials

Electronic, Optical, and Magnetic Properties

Energy and Environmental Technology

Information and Telecommunications Technology

Magnetic Materials

Magnetic Properties

Manufacturing

Materials Culture

Materials for Energy and Environmental Applications

Materials Processing

Materials Theory

Mechanical Behavior of Materials

Mechanical Properties and Nanomechanics

Nanopatterning

Nanotechnology

Optical and Photonic Materials

Optoelectronics

Organic Polymer Materials

Phase Transformations

Self Assembly

Shape Deposition Manufacturing

Surfaces, Interfaces, and Thin Films

Thin-Film Deposition

Transport Properties

All accepted papers of ICKEM 2012 will be published by Advanced Materials Research Journal, which will be indexed by EI Compendex.

Advanced Materials Research (ISSN: 1022-6680) is Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.

SUBMISSION METHODS:

1. Electronic Submission System; ( .pdf)

If you can't login the submission system, please try to submit through method 2.

2. Email: ickemvip.163.com ( .pdf and .doc)