ICICTES 2012 - Third International Conference on Information and Communication Technology for Embedded Systems

Website http://www.icictes2012.org/ | Edit Freely

Category ICICTES 2012

Deadline: January 23, 2012 | Date: March 22, 2012-March 24, 2012

Venue/Country: Bangkok, Thailand

Updated: 2012-01-16 22:42:32 (GMT+9)

Call For Papers - CFP

Technology for Embedded Systems

VIE Hotel, Bangkok, Thailand 22-24 March 2012

URL: http://www.icictes2012.org/

CALL FOR PAPER

The Third International Conference of Information and Communication

Technology for Embedded Systems (IC-ICTES 2012) is established to

provide an international forum for researchers and industry

practitioners to share their new ideas, original research results and

practical development experiences from all embedded system-related

areas including ubiquitous computing, pervasive computing, embedded

system design, development of new HW/SW-related theories and

techniques in embedded systems, information and communication

technology for supporting development of embedded systems, and

information and communication technology used in embedded systems.

AREAS OF INTEREST

The conference calls for research papers reporting original

investigation results of research and development on real embedded

system applications and their system development. Topics in IC-ICTES

2012 are listed below, but not limited to:

A. Embedded system architecture: Multiprocessors, reconfigurable

platforms, memory management support, communication, protocols,

network-on-chip, real-time systems, embedded microcontrollers.

B. Real-time systems: All real-time related aspects such as software,

distributed real-time systems, real-time kernels, real-time OS, task

scheduling, multitasking design.

C. Embedded hardware support: System-on-a-chip, DSPs, hardware

specification, synthesis, modeling, simulation and analysis at all

levels for low power, power-aware, testable, reliable, verifiable

systems, performance modeling, validation, security issues, real-time

behavior and safety critical systems.

D. Embedded software: Compilers, assemblers and cross assemblers,

programming, memory management, object-oriented aspects, virtual

machines, scheduling, concurrent software for SoCs,

distributed/resource aware OS, OS and middleware support.

E. Hardware/software co-design: Methodologies, test and debug

strategies, real-time systems, specification and modeling, design

representation, synthesis, partitioning, estimation, design space

exploration beyond traditional hardware/software boundary and

algorithms.

F. Testing techniques: All aspects of testing, including

design-for-test, test synthesis, built-in self-test, embedded test,

for embedded and system-on-a-chip systems.

G. Application-specific processors and devices: Network processors,

real-time processor, media and signal processors, application specific

hardware accelerators, reconfigurable processors, low power embedded

processors, bio/fluidic processors, Bluetooth, hand-held devices, _ash

memory chips.

H. Industrial practices and benchmark suites: System design, processor

design, software, tools, case studies, trends, emerging technologies,

experience maintaining benchmark suites, representation, interchange

format, tools, copyrights, maintenance, metrics.

I. Embedded computing education: Curriculum issues, teaching tools and

methods.

J. Emerging new topics: New challenges for next generation embedded

computing systems, arising from new technologies (e.g.,

nanotechnology), new applications (e.g., pervasive or ubiquitous

computing, embedded internet tools) and new principle (e.g., embedded

Engineering).

K. Embedded System Applications: All ranges of applications on

embedded system, including speech processing, image processing,

network computing, distributed computing, parallel computing and power

conversion.

L. Automotive Engineering: Automotive design, new challenges

on development of autoparts and automatives, safety engineering, fuel

economy/emissions, vehicle dynamics, NVH engineering, automotive

performance, shift quality, durability/corrosion engineering,

package/ergonomics engineering, climate control, derivability, program

timing, assembly feasibility, automotive embedded systems.

IMPORTANT DATES

Submission deadline: 23 January 2012

Notification of acceptance: 6 February 2012

Camera-ready submission 20 February 2012

Early registration 20 February 2012

Conference 22-24 March 2012

PAPER SUBMISSION

Proceedings will be published by TAIST Tokyo Tech Program, National

Science and Technology Development Agency (NSTDA). The first page

should include the paper title, the names and the complete mailing

addresses of all authors, and the e-mail address of the corresponding

author. Each paper should consist of up to 200-word abstract, up to 5

keywords. All the text, figures and reference must be between 4-6

double-column A4 pages with font size of 10 points. Authors MUST use

IEEE manuscript submission guidelines (available at

http://www.ieee.org/authors.html) for their initial submissions. All

papers must be submitted electronically in PDF format only, using the

conference management tool. The submitted papers must not be published

or under consideration to be published elsewhere.

For further information, Please contact

Thanaruk Theeramunkong

Sirindhorn International Institute of Technology,

Thammasat University, Thailand

Tel: +66-2-501-3505 ext. 2004

Fax: +66-2-501-3505 ext. 2001

Email: icictes12 at siit.tu.ac.th