VLSI 2013 - The Computer Journal Special Issue on 3D VLSI System Integration

Website http://www.oxfordjournals.org/our_journals/computer_journal/special.html | Edit Freely

Category VLSI 2013

Deadline: November 01, 2011 | Date: January 30, 2013

Venue/Country: Online, Online

Updated: 2011-11-14 09:21:05 (GMT+9)

Call For Papers - CFP

Recent advances in three-dimensional (3-D) VLSI technology provide a promising platform to realize multicore, multiprocessor and networks-on-chip (NoC) systems with augmented performance. Stacking multiple layers of logic, memory and interface dies together in a chip allows complex system integration with higher silicon density and shorter interconnect path lengths. It also enables emerging platforms that integrate heterogeneous modalities such as MEMS, antennas and sensors and so on in a single chip, to deliver unprecedented integration density and novel functionailities.

The Computer Journal is calling for papers for a Special Issue on 3D VLSI System Integration with a deadline of 1st November 2011. Topics of interest include, but are not limited to:

- 3D integration technology, e.g. TSV, 3D IC process

- 3D Networks-on-Chip

- 3D thermal aware design methodologies and tools

- EDA method and tools

- Monolithic and heterogeneous 3D integration (e.g. for MEMS, NEMS)

- 3D memory, processor, DSP and FPGA

- 3D RF and microwave/millimeter wave

- 3D biomedical circuits and systems

- 3D applications

- 3D design and test methodology

- 3D prototypes

Original and high-quality contributions that have not yet been published or are not currently under review by other journals or peer-reviewed conferences are sought.

Information concerning the preparation of manuscripts and their format can be found here.

Instructions for submission can be found at: http://mc.manuscriptcentral.com/compj. Authors must state that the paper is for the SI “3D VLSI”.

All papers will be reviewed based on their originality, high scientific quality, organization, clarity of writing, conclusions and relevance to this Special Issue. The manuscripts will be accepted or rejected in line with the usual standards of The Computer Journal.

Authors of accepted papers at the “Frontier in 3D Integration Engineering Special Session” at the VLSI-SoC conference are encouraged to submit an extended version of their paper. There should be at least 30% difference between the extended/ revised paper and the special session paper, and the papers will be handled as all other papers in matters of refereeing and selection.

**Important dates**

Submission deadline: 1 November 2011

Acceptance/ revision/ rejection notification no later than: 16 December 2011

Publication date: late 2012 or 2013

**Guest editors**

Dr. Terrence Mak

School of Electrical, Electronic and Computer Engineering, Newcastle University, Newcastle upon Tyne, UK

Dr. Chi-Sang Poon

Harvard-MIT Division of Health Sciences and Technology, MIT, Cambridge, USA