CAD 2012 - IEEE Transactions on CAD Special Section on Three-dimensional Integrated Circuits and Microarchitectures

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Category CAD 2012

Deadline: March 15, 2012 | Date: August 01, 2012

Venue/Country: Online, Online

Updated: 2011-12-19 13:04:42 (GMT+9)

Call For Papers - CFP

Special Section on Three-dimensional Integrated Circuits and Microarchitectures

In recent years, the area of three-dimensional (3D) Integrated Circuits has

become a very attractive research topic due to its potential for extending

MooreÕs momentum in the next decade. The key benefits of 3D ICs over

traditional two-dimensional chips include the potential of reduced overheads

for global interconnects, higher packing densities and smaller footprints,

heterogeneous integration, and faster times-to-market. To efficiently exploit

the benefits of 3D technologies, design techniques and methodologies for

supporting 3D designs are imperative; design space exploration at the

architectural level is also essential to fully take advantage of the 3D

integration technologies to build a high- performance, energy-efficient

integrated systems, GPUs, system-on-chips, heterogeneous systems, and other

integrated systems.

We are pleased to announce a call for papers for a special section of TCAD on

Three-dimensional (3D) Integrated Circuits. We welcome submissions to this

special section based on new, unpublished contributions. Submissions may also

be based on work previously published in refereed conferences/workshops; if so,

the submission must contain at least 30% new materials, and the authors must

provide a cover letter clearly stating how the submission differs from and/or

expands on the previously-published work.

Areas of interest for this special section include (but are not limited to) the

following topics:

* Physical design methodologies/tools/algorithms for 3D

* High-level synthesis/logic synthesis for 3D ICs

* ESL design methodologies and tools for 3D ICs

* Thermal analysis and thermal-aware designs

* 3D architectures and design space exploration

* 3D Test, design-for-test, and debug techniques

* Signal and power integrity, and ESD in 3D

* Chip-package co-design for 3D

* Economic benefit/cost trade-off studies

* Application, product, or test-chip case studies

Please submit your paper at the TCAD website,

http://mc.manuscriptcentral.com/tcad. Please specify "Special Section on 3D ICs

and Microarchitectures" on your cover page and in the notes section of the

Web site submission form.

IMPORTANT DATES

Submission Deadline: 15 March 2012

Acceptance Notice: 1 July 2012

Final Manuscript Due: 1 August 2012