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    ICOPE 2010 - International Conference on Precision Engineering ICoPE 2010 & 13th ICPE

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    Website http://www.simtech.a-star.edu.sg/ICoPE2010 | Want to Edit it Edit Freely

    Category ICOPE 2010

    Deadline: November 01, 2009 | Date: July 28, 2010

    Venue/Country: Singapore, Singapore

    Updated: 2010-06-04 19:32:22 (GMT+9)

    Call For Papers - CFP

    International Conference on Precision Engineering ICoPE2010 & 13th ICPE

    28 ? 30 July 2010, Singapore

    ICoPE2010 is the fourth in the series of International Conferences on Precision Engineering (ICoPE) in Singapore. The first three ICoPE conferences were held in 1995, 2000 and 2003/04 in Singapore, respectively.

    The International Conference on Precision Engineering (ICPE) has been organised by the Japan Society for Precision Engineering (JSPE) since the first conference, held in Tokyo, Japan in 1974. The term "nanotechnology" was first defined by Professor Taniguchi at this conference. The first eleven ICPE conferences were held in Japan; the twelfth was held jointly with the ASPE conference in Portland USA in 2008. ICPE has focused on state-of-the-art production

    engineering and is always forward-looking towards next-generation technologies.

    The objective of this joint conference is to provide an excellent platform to update and discuss the latest advances in precision engineering-related fields by researchers and engineers from research laboratories, academia and industry.

    Topics for the conference include, but are not restricted to:

    A. Precision machining: micro/nano-precision machining, polishing, grinding, chemical

    mechanical polishing (CMP)

    B. Non-traditional machining: ultrasonic machining, electrical discharge machining

    (EDM), electrochemical machining (ECM), laser machining, beam machining

    C. Manufacturing systems: reliability, performance evaluation and optimisation,

    manufacturing information, design, CAD/CAM, Virtual Reality (VR)

    D. Advanced moulding and forming: precision and micro forming, process simulation,

    die and mould design

    E. Machine condition monitoring, control, and diagnosis

    F. MEMS/NEMS: micro-electromechanical systems, nano-electromechanical systems,

    microfluidics

    G. Mechatronics: machine elements, sensors, actuators, robotics

    H. Measurement and test: Nano- and micro-measurement and characterisation, non-

    destructive testing

    I. Optical measurement: laser, microscopy, interferometry, image processing

    J. Advanced materials and functional surfaces: thin films, surface texturing, tribology,

    semiconductor processing

    K. Bio and medical manufacturing

    L. Green and sustainable manufacturing

    M. Rapid manufacturing: rapid prototyping, rapid tooling, on-demand manufacturing

    N. Machine tools: high feed rate, high speed spindles, machining dynamics, virtual

    machining simulation, cutting tools, chattering

    The official language of the conference is English. All conference papers and presentations will be in English. No simultaneous interpretation will be provided.


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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