Our Sponsors
CEABM 2013 - 2013 3rd International Conference on Civil Engineering, Architecture and Building Materials (CEABM 2013)
Website www.ceabm.org |
Edit Freely
Category civil, architecture;building materials;engineering;materials;manufacturing;energy;computer;technology;automation
Deadline: April 30, 2013 | Date: May 25, 2013-May 26, 2013
Venue/Country: Jinan, China
Updated: 2013-02-17 10:26:46 (GMT+9)
Call For Papers - CFP
CEABM series provides a forum for accessing to the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of Civil Engineering, Architecture and Building Materials. The meeting will provide an opportunity to highlight recent developments and to identify emerging and future areas of growth in this exciting field. The 1st international International Conference on Civil Engineering, Architecture and Building Materials (CEABM 2011) was successfully taken place in Haikou, China, June 18-20, 2011. All accepted papers from this conference were published on Advanced Materials Research journal and had been indexed into EI Compendex, Thomson ISTP and Elsevier SCOPUS databases. Following the success of the inaugural conference, the 2nd International Conference on Civil Engineering, Architecture and Building Materials (CEABM 2012) was successfully held in Yantai, China, May 25-27, 2012. All accepted papers from this conference were published on Applied Mechanics and Materials journal and had also been indexed into EI Compendex, Thomson ISTP and Elsevier SCOPUS databases. the 3rd/2013 International Conference on Civil Engineering, Architecture and Building Materials (CEABM 2013) will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field. After refereeing process, all accepted papers from CEABM 2013 will be published on international journal "Applied Mechanics and Materials" and will be indexed in the major academic databases, including EI Compendex, Thomson ISI (ISTP), and other indexing services. (See TTP's Conference List). Trans Tech Publications will provide online camera-ready paper submission system to save time and decrease the publishing cycle. The full text is online available via platform www.scientific.net. Selected excellent papers will be published on SCI journals.Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.