ICEP201 2010 - ICEP2010 International Conference on Electronics Packaging

Website http://www.jiep.or.jp/icep/ | Edit Freely

Category ICEP201 2010

Deadline: November 15, 2009 | Date: May 12, 2010

Venue/Country: Hokkaido, Japan

Updated: 2010-06-04 19:32:22 (GMT+9)

Call For Papers - CFP

May 12 -14, 2010

Sapporo Convention Center, Hokkaido, Japan

Sponsored by JIEP, and IEEE CPMT Society Japan Chapter

Technical Topics for Conference Papers

Sessions and Keywords:

1. Advanced Packaging

Area array packages, SiP, PoP, PiP, wafer level packaging, system

integration, LCD modules, MCM, and System on Package

2. Substrate

Laminates, interposers, fine pitch, build-up substrates, FPC (Flexible

Printed Circuits), embedded, conductive paste, thin core, coreless,

low CTE, and thin film wiring

3. Design, Modeling, and Reliability

Signal integrity, power integrity, thermal management, high speed

board design, reliability, failure analysis, testing, evaluation, and

EDA

4. Manufacturing and Process

Flip chip, plating, inkjet, process control, equipment, thin films,

underfills, encapsulation, molding, and fluxes

5. Interconnection

Flip chip, wire bonding, soldering, bump formation, NCF/NCP,

ACF/ACP and fluxless joining

6. Optoelectronics

Photonic devices, optical fibers, wave guides, optical interconnects,

transceivers, connectors, LD/PD, LED, OE/EO, TOSA/ROSA,

WDM, and optical wiring boards

7. Printed Electronics

Inkjet, screen printing, conductive wiring, insulation, printed organic

TFT, and device applications

8. 3D and TSV

Silicon stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, TSV,

via formation and filling, wafer thinning, wireless interconnection,

and 3D LSI design and CAD system

9. MEMS/Sensor

MEMS/Sensor devices, process, assembly and packaging, system

integration, and MOEMS

10. Self-Organization/Self-Assembly

Nano materials/devices by self-organization/self-assembly,

Dissipative structures, hierarchical structures, bottom-up manufacturing

Bio-mimetic, nature-oriented processes/design/applications

11. Emerging Technologies

Nano technology, and organic semiconductors

12. RF

RFID, high frequency devices, packaging, filters, EMI, EMC, and

antennas

13. Automotive Electronics

Power devices, power electronics, ECU, sensors, lead free solder, and

wire harness

14. Energy and Environment

PV, lead free, fuel cells, power electronics, and power devices

15. Others

Market trends, environmentally conscious product and processes, and

cost analysis

Abstract and Paper Submission:

300-word abstract to be submitted to the secretariat by e-mail or fax by November 15, 2009

Notification of acceptance by the middle of December, 2009

Final manuscript to be submitted by March 19, 2010

Registration Fees:

Speakers: 40,000 yen (including reception and the proceedings)

Students: 5,000 yen (including the proceedings)

Organizing Committee:

General Chair: M. Mori, Toshiba

Vice General Chairs: Y. Orii, IBM Japan and M. Nakamura, Hitachi

Contact:

Secretariat of ICEP 2010

JIEP (Japan Institute of Electronics Packaging)

E-mail: icep2010jiep.or.jp

URL: http://www.jiep.or.jp/icep/

Abstract Submission Form

Please attach this form to your abstract

Paper Title:

Session Preference:

Primary Session Name :

Secondary Session Name :

Keywords :

Presentation Style : □Oral □Poster (Student only)

Submitted papers may be assigned to other/additional sessions at the discretion of the technical program committee.

You may select up to five keywords.

Author Information:

Prefix: Prof. [ ], Dr. [ ], Ms. [ ], Mr. [ ] / [ ] Student

First Name Last Name

Name:

Membership No.: JIEP IEEE

Company or Institution:

Department or Division:

Address:

Zip Code: Country:

Phone: Fax:

E-mail:

Publication Schedule:

300-word abstract submission deadline: November 15, 2009 by e-mail or fax

Notification of acceptance: middle of December, 2009

Submission of final manuscript: March 19, 2010

Please send your abstract and this form by e-mail or fax.

Fax: +81-3-5310-2011, E-mail: icep2010jiep.or.jp

ICEP2010