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S2P 2010 - 11th International Conference on Semi-Solid Processing of Alloys and Composites (S2P2010)
Website www.s2p2010.ustb.edu.cn |
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Category S2P 2010
Deadline: December 31, 2009 | Date: September 16, 2010
Venue/Country: Beijing, China
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
S2P2010 conference in Beijing will provide a good chance for academic and industry professionals to discuss recent progresses in the area of semi-solid forming of alloys and composites. An abstract in English of about 300 - 400 words is expected. Abstracts have to be submitted at first through the conference email s2p2010
mater.ustb.edu.cn before Dec.31th 2009. If the abstracts are accepted, the author will receive the login and password from the conference secretariat . Abstracts received after this date will not be considered. Revised papers must be submitted through the website by June 30th, 2010. Manuscripts will be reviewed by the Scientific Committee. All accepted papers will be published by one renowned journal. The conference language is English. Conference TopicsThe conference will concentrate on the advancement of fundamental knowledge and development of materials and industrial processes for semi-solid manufacturing of high performance metal components. The conference topics will cover, but not limited to, the following subjects:1）Material Development and Alloy Design?Magnesium and aluminum Alloys?Composites?High melting point alloys?Other alloys2）Microstructure & Properties?Microstructure development in semi-solid state?Microstructure evolution during semi-solid forming?Mechanical properties of semi-solid materials?Other properties3）Rheology, Modelling and Simulation?Rheological behaviour of semi-solid slurries?Modelling of rheological behaviour?Modelling of microstructure evolution?Simulation of semi-solid forming processes4）Process DevelopmentThixoforming?Heating processes and equipment?Rheoforming?Novel processes?Tool design and development5）Industrial Applications?Industrial technology and applications?Economic potential and competing processes?Ecological assessment of SSM technologiesKeywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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