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ESTC 2010 - 2010 3rd Electronic System-Integration Technology Conference (ESTC)
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Website www.estc-2010.de |
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Category ESTC 2010
Deadline: February 01, 2010 | Date: September 01, 2010
Venue/Country: Berlin, Germany
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
ESTC 2010 seeks original papers describing research in all areas of electronic packaging. Papers may be submitted to the following tracks (see also Conference Topics below):Advanced packaging
Microsystem packaging
New materials and processes
Optoelectronics
Assembly and manufacturing technology
Modelling and simulation
Applied reliability
Power electronics
Electrical design and modelling
Emerging technologies
Download Call for Papers here.
Conference Topics
Advanced Packaging
Chair: Klaus Pressel, Infineon, Germany
Co-Chair: Gilles Poupon, CEA-LETI, France
Advanced packaging involving new materials
Wafer level packaging including assembly and packaging for > 45nm CMOS devices
System-in-Package (SiP), involving MEMS and power packaging
RF, MEMS and power packaging
Improved thermal management and new design, environmental protecting packaging
Fine pitch and high lead count packaging in CSP, BGA, CGA, LGA or SMT packages
Innovative interconnects applied to advanced packaging
Microsystem Packaging
Chair: Werner Wilke, VDI/VDE, Germany
Co-Chair: Roland Müller-Fiedler, Bosch, Germany
Application and product-oriented packaging technologies
New approach of sensor and actuator principles
Integration of new functionality in microsystems
Micro-nano integration
Nanobased advanced packaging technologies (e.g. self assembly, top-down and bottom-up approach, integration of nano-objects, CNT, tools, process)
New Materials and Processes
Chair: Johan Liu, Chalmers University Göteborg, Sweden
Co-Chair: Paul Conway, Loughborough University, UK
IC packaging processes including bonding and plating processes
Technology, development and application for adhesives, encapsulants, interconnect materials on substrate and wafer level
Added functionality materials: magnetic, thermal, optical, nano-enhanced
Optoelectronics
Chair: Giovanni Del Rosso, Pirelli Labs, Italy
Co-Chair: Harri Kopola, VTT, Finland
Packaging & interconnection strategies for novel roll-to-roll lighting devices
100Gb/s Ethernet PIC & ultra-wide band optical transceivers
Power LED and solid state lighting
Optical PCB: optical and electrical signal integration
Hi-power diode laser packaging, couplings, fiber pigtailing and connectorization
Concentrating photovoltaics (CPV) and optoelectronics in energy
Assembly and Manufacturing Technology
Chair: David Whalley, Loughborough University, UK
Co-Chair: Carlo Cognetti, STMicroelectronics, Italy
Advanced process development and equipment improvement for volume production
Cost, yield, performance and environmental impact improvements
Process characterization
New product introduction and ramp-up
Design for flexible manufacturing, testing and burn-in, and design for manufacturing
Manufacturing simulation, optimisation and scheduling
MEMS and opto-electronic assembly
Board level, product and system level assembly
Modeling and Simulation
Chair: Bernd Michel, Fraunhofer IZM, Germany
Co-Chair: E. Mazza, ETH Zürich, Switzerland
Electrical and mechanical modelling
Simulation and characterization of packaging solutions including system-level applications
Prediction of thermal and mechanical performance of packages and modules
Applied Reliability
Chair: Kouchi Zhang, Philips, The Netherlands
Co-Chair: Hans-Jürgen Albrecht, Siemens, Germany
Reliability field data analysis
Fast reliability quaification
Advanced failure analysis
Failure mode identification and ranking
Reliability modeling, reliability diagnostics and curing
Failure prediction and experimental verification
Characterization and modeling of material
Process and product behaviour
Lifetime prediction
Reliability standards
Power Electronics
Chair: Martin Schneider-Ramelow, Fraunhofer IZM, Germany
Co-Chair: Thomas Harder, ECPE European Center for Power Electronics, Germany
Further development of high power devices (e.g. IGBT-, MOSFET-packaging)
Alternative packaging and cooling concepts (e.g. double-sided cooling)
Prediction of thermal and thermo-mechanical performance of packages and modules
Reliability investigations and life time prediction
High temperature applications
Electrical Design & Modeling
Chair: Prof. Elst, Fraunhofer IIS, Germany
Technology-aware design of circuits and systems - from architectural design to implementation level
Multi domain system level modelling
Design for manufacturability and testability
Design approaches for robust, fail safe and fault tolerant systems
Impact of integration technology - SiP and 3D
Advanced methods for 3D floor planning and place & route
Emerging Technologies
Chair: Klaus-Jürgen Wolter, TU Dresden, Germany
Co-Chair: Toni Mattila, TU Helsinki, Finland
Nano-packaging and bio-electronic packaging
Organic printable electronics packaging
Green electronic packaging
Portable power supply packaging
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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