RTP 2009 - 2009 17th International Conference on Advanced Thermal Processing of Semiconductors (RTP)

Website http://www.ieee-rtp.org/ | Edit Freely

Category RTP 2009

Deadline: May 31, 2009 | Date: September 29, 2009

Venue/Country: NY, U.S.A

Updated: 2010-06-04 19:32:22 (GMT+9)

Call For Papers - CFP

The Conference is accompanied by a one day tutorial workshop "Metrology for ion-implant and diffusion engineering" which will be held on September 29, 2009.

The committee invites leaders in the semiconductor industry to submit papers based on all aspects of Thermal Processing of Semiconductors.

Important Dates:

Abstract Submission Deadline May 31, 2009

Abstracts Review Period June 1, 2008 - June 14, 2009

Notification of Acceptance June 14, 2009

Final Paper Submission Deadline: August 31, 2009

CALL FOR PAPERS

17th IEEE International Conference on Advanced Thermal Processing of Semiconductors

IEEE RTP 2009

Marriott Hotel Albany, NY

September 29 - October 2, 2009

Conference Chair:

Bo Lojek

ATMEL

Regional Chairs: Europe America Far East

Vittorio Privitera Jeff Gelpey Kyoichi Suguro

IMM CNR Mattson Technology Toshiba

Conference Committee:

Philippe Absil Andrew Hawryluk Jeff Gelpey Aaron Hunter

IMEC Ultratech Mattson Technology Applied Materials

Veronique Carron Michael Current Robert James Wolfgang Skorupa

CEA/LETI Current Scientific INTEL FZ-Rossendorf

Wilhelm Kegel Aomar Halimaoui Jim Nakos Kentaro Shibahara

Qimonda STMicroelectronics IBM Hiroshima University

Hiroshi Iwai Vittorio Privitera Vikram Singh Benjamin Tsai

Tokyo Inst. of Technol. IMM-CNR Varian NIST

Karuppanan Sekar Julien Venturini Masahisa Okuno Shigeru Kasai

SemEquip EXCICO Kokusai Tokyo Electron

Helen Maynard Masataka Kase Hiroshi Kiyama Satoru Muramatsu

VSEA Fujitsu Dainippon Screen NEC

Lis Nanver Andrea E. Pap Takeshi Karasawa Bunji Mizuno

TU Delft Hungarian Academy of Sciences Ushio Ultimate Junction

IEEE RTP'2009 is a conference for engineers, scientists, managers and marketing specialists working in thermal processing of semiconductors, manufacturing, simulation and equipment development. The goal is to provide a comprehensive overview of current and future directions of thermal processing technology and processing systems. The primary emphasis will be on the state-of-the-art tools and RTP and Furnace concepts and methods as they apply to commercial ULSI processing. Papers are sought in the following areas:

Thermal Processing of Nanomaterials and Nanostructures

Advanced Dielectric Formation and RTPCVD

Diffusion, Dopant Activation and Junction Formation

Application of Thermal Processes to Front and Back End Manufacturing

RTP and Advanced Thermal Processing Equipment

Temperature Measurement and Control

Heat Transfer in Microstructures

Modeling and Simulation of Thermal Processes

Strategies for RTP and Furnace Processing in the Manufacturing Environment

All submissions should include title, list of authors with affiliations, and an abstract not exceeding 300 words. Abstracts should be submitted electronically as a Microsoft Word or Adobe PDF document. To submit a paper, please follow instructions in the folder Submit Abstract. Accepted papers will be published in the archival conference proceeding, with no page limit.

DEADLINE FOR ABSTRACT SUBMISSIONS IS MAY 31, 2009.

All correspondence should be addressed to any member of the Conference Steering Committee or to:

IEEE RTP 2009 Conference

http://www.IEEE-RTP.org