Our Sponsors
EMA 2011 - 2011 Electronic Materials and Applications (EMA 2011)
Website ceramics.org/electronic-materials-and-applications-2011 |
Edit Freely
Category EMA 2011
Deadline: August 02, 2010 | Date: January 19, 2011
Venue/Country: Lake Buena Vista, U.S.A
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
Electronic Materials and Applications 2011, jointly programmed by the Electronics Division and Basic Science Division of ACerS, is the second in a series of annual international meetings. The focus of the 2011 meeting is on electronic ceramics for energy generation, conversion and storage applications, and will bring together leaders and experts in the field to address the materials related challenges to these topics.Who Should Attend
EMA 2011 is designed for materials scientists, engineers, students, researchers and manufacturers with an interest in renewable energy, innovative hybrid and all-electric transportation development, electrical ceramics and advanced microelectronics. This meeting will continue to foster this atmosphere and facilitate these relationships.
Programming
The technical program will include invited lectures, contributed papers, poster presentations, roundtables on emerging topics, and participation of the President’s Council of Student Advisers, the Society’s new student-led group. With increased investment in renewable energy, “smart grid” technologies, all-electric vehicles and innovative hybrid transportation development, electrical ceramics are positioned as the key enabler of technologies. In addition, there is growing interest in energy harvesting, integrated sensors, bio-inspired vehicles and systems, and advanced functional microelectronics, where integrated electrical ceramics and composites will play a key role. EMA 2011 aims to provide the current state-of-the-art in applications of these materials, the fundamental science of materials processing, and advanced methods for materials integration.
Organization
Organizing Committee
Shashank Priya
Virginia Tech
Phone: 540-231-0745 Juan C. Nino
University of Florida Quanxi Jia
Los Alamos National Lab
Technical Programming Committee
Paul Clem, Sandia National Labs; Amit Goyal, Oak Ridge National Lab; Jacob Jones, University of Florida; Jian Luo, Clemson University; Wolfgang M. Sigmund, University of Florida; Clive Randall, Pennsylvania State University; Susan Troiler-Mckinstry, Pennsylvania State University; Juan Nino, University of Florida; Qi Tan, General Electric; Victoria Knox, PCSA; Nian Sun, Northeastern University; Steven Tidrow, University of Texas Pan American; Kristen Brosnan, General Electric; Alp Sehirlioglu, NASA-Glenn; Jeff Zhand, APC International; Thomas Daue, Smart Material Inc.; Michelle Bell, Radiant Technologies; Ahmad Safari, Rutgers University; Takaaki Tsurumi, Tokyo Institute of Technology.
.
International Scientific Advisory Committee (ISAC)
Jurgen Roedel, Darmstadt University of Technology; Michael Glazer, Clarendon Laboratory; Haosu Luo, Shanghai Institute of Ceramics, Chinese Academy of Sciences; Sahn Nahm, Korea University; Jungho Ryu, Functional Ceramics Group, Korea Institute of Materials Science (KIMS)
Basic Science Division Officers
Chair: Keith Bowman
Chair-Elect: Helen M. Chan
Vice Chair: Scott Misture
Secretary: Kevin Trumble
Programming Chairs (2011):
Daniel Mumm and Jian Luo
Past Chair: Elizabeth Dickey
Electronics Division Officers
Trustee: Dwight Viehland
Chair: Paul Clem
Chair-Elect: Shashank Priya
Vice-chair: Amit Goyal
Secretary: Quanxi Jia
Secretary-Elect: Steven C. Tidrow
Programming Chairs (2011): Quanxi Jia
Past Chair: Sharmila M. Mukhopadhyay
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.