ETS 2009 - ETS 2009 14th European Test Symposium
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Website http://www.ieee-ets.org |
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Category ETS 2009
Deadline: January 26, 2009 | Date: May 25, 2009
Venue/Country: Sevilla, Spain
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
General Chair: J.L. Huertas Diaz ¨C CNM (E)O. Novak - Czech Tech. Univ. (Cz)Program Chair / Vice Chair:J.-P. Teixeira ¨C IST/TUL, INESC-ID (P)E. Gramatova ¨C Slovak Acad. Sc. (SK) Topic Chairs:B. Becker ¨C U. Freiburg (D)S. Hellebrand ¨C U. Paderborn (D)H. Kerkhoff ¨C U. Twente (NL)E. Larsson ¨C Linköping U. (S)R. Leveugle ¨C TIMA (F)P. Muhmenthaler ¨C Infineon (D)N. Nicolici ¨C McMaster U. (CAN)M. Renovell ¨C LIRMM (F)Industrial Relations Chair:P. Harrod - ARM Ltd (UK)Publication Chair:C. Metra ¨C U. Bologna (I)Panel Chair:H.-J. Wunderlich ¨C U. Stuttgart (D)Tutorial Chair:P. Girard ¨C LIRMM (F)Embedded Tutorial Chair:P. Prinetto ¨C Politecnico di Torino (I)ETS Fringe Workshops:B. Al-Hashimi ¨C U. Southampton (UK)Ph.D. Forum Chair:I. Polian ¨C U. Freiburg (D)Regional Liaisons:L. Carro ¨C UFRGS (BR)A. Singh ¨C Auburn U. (USA)A. Osseiran ¨C Edith Cowan U. (AUS)S. Kajihara ¨C Kyushu IT (J)Program Committee:M. Abadir, USA L. Miclea, ROR. Aitken, USA S. Mir, FZ. Al-Ars, NL S. Mitra, USAD. Appello, I Y. Miura, JF. Azais, F F. Novak, SLOM. Azimane, NL O. Novak, CZL. Balado, E A. Orailoglu, USAA. Benso, I S. Ozev, USAG. Carlsson, S A. Pataricza, HK. Chakrabarty,USA F. Poehl, DW. Daehn, D I. Polian, DR. Dorsch, D I. Pomeranz, USAM.-L. Flottes, F J. Raik, EEH. Fujiwara, J J. Rajski, USAF. Fummi, I A. Richardson, UKD. Gizopoulos, GR J. Rivoir, DE, Gramatova, SK B. Rouzeyre, FS. Hamdioui, NL A. Rubio, EM. Hirech, USA A. Rueda, EA. Hlawiczka, PL K.K. Saluja, USAM. S. Hsiao, USA P. Sanchez, EP. Hughes, UK S. Sattler, DA. Ivanov, CAN J. Segura, ES. Kajihara, J J.-P. Teixeira, PA. R. Kapur, USA N. Touba, USAA. Krasniewski, PL J. Tyszer, PLB. Kruseman, NL R. Ubar, EES. Kundu, USA B. Vermeulen, NLM. Lubaszewski, BR C. Wegener, DY. Makris, USA X. Wen, JH. Manhaeve, B C.-W. Wu, TWE.J. Marinissen, B M. Zwolinski, UKM. Abadir, USA L. Miclea, ROSteering Committee:Chair: H.-J. Wunderlich ¨C U. Stuttgart (D) Al-Hashimi, UK Z. Peng, SB. Becker, D P. Prinetto, IJ. Figueras, E M. Renovell, FC. Landrault, F M. Sonza Reorda, IE.J. Marinissen, NL J.-P. Teixeira, PP. Muhmenthaler, D Y. Zorian, USAOrganizing Committee:A. Rueda - FinanceG. Huertas - ProceedingsD. Vazquez - Local ArrangementE. Peralias &A. Acosta - RegistrationG. Leger - Audio/visualS. Sanchez - Web Preliminary Call for PapersThe IEEE European Test Symposium (ETS) is Europe¡¯s premier forum dedicated to presenting and discussing scientific results, emerging ideas, practical applications, hot topics, and new trends in the area of electronic-based circuit and system testing. In 2009, ETS will take place in the nice town of Seville, Andaluc¨ªa, in southern Spain. ETS¡¯09 is being organized by Instituto de Microelectr¨®nica de Sevilla (CSIC and Univ. de Sevilla), and is sponsored by the Test Technology Technical Council (TTTC) of the IEEE Computer Society.You are invited to participate and submit your contributions to ETS¡¯09. The areas of interest of ETS¡¯09 include (but are not limited to) the following topics:Automatic Test GenerationFault Modeling and SimulationCurrent-Based TestPower Issues in TestThermal TestDelay and Performance TestHigh-Speed IO/Interconnect TestSignal Integrity TestNanometer Technologies TestATE Hardware and SoftwareStandards in TestingTest(ability) SynthesisBuilt-In Self Test (BIST)Design for Test(ability) (DfT)Test Data CompressionOn-Line TestSelf-Repair MethodologiesTest of Reconfigurable SystemsAnalog, Mixed-Signal, RF TestMemory Test and RepairMicroprocessor TestGALS TestMEMS TestDigital Power Supply TestingFailure AnalysisDiagnosis and DebugDesign Verification and ValidationLifetime TestTest Quality and ReliabilityYield Analysis and EnhancementDefect and Fault ToleranceBoard and System TestEmbedded Systems TestHigh-Level DfT and TPGSystem-on-Chip (SoC) TestSystem-in-Package (SiP) TestPublications ¨C ETS¡¯09 will produce a Formal Proceedings, published by the IEEE Computer Society, and a Web-Based Electronic Informal Digest of the selected papers. The best contributions will be selected for submission to regular issues of the ¡°Journal of Electronic Testing: Theory and Applications¡± (JETTA), published by Springer. ETS¡¯09 will present a Best Paper Award at ETS¡¯10.Submissions ¨C ETS¡¯09 seeks original, unpublished contributions of the following types:Scientific papers, presenting novel and complete research workWorkshop-type papers, including emerging ideas and practical case studiesVendor Session presentations, focusing on new features of test-related productsProposals for panels, embedded tutorials, and other special sessions.Detailed submission instructions, including selection criteria and publication policies, for the various types of contributions are posted on the ETS web page.IEEE TTTC Test Technology Educational Program (TTEP) tutorials on test technology topics will be offered during ETS¡¯09. Tutorial proposals should be submitted according to TTEP 2009 submission deadlines (http://computer.org/tab/tttc/teg/ttep
).As a new initiative for ETS¡¯09, a Ph.D. Forum will be organized. Moreover, the ETS¡¯09 organizing committee would like to encourage the organization of fringe workshops and will provide extensive support for the organization of such events. Full details can be found on the ETS web page.Key Dates:¡¤ Submission deadline: December 7, 2008¡¤ Notification of acceptance: February 16, 2009¡¤ Camera-ready manuscript : March 16, 2009Further Information:Jos¨¦ Lu¨ªs Huertas ¨C General ChairIMSE-CNM, Univ. SevillaAvda. Reina Mercedes S/N41012 Sevilla, SpainTel.: +34-95-505-6666Fax: +34-95-505-6692Email: huertas
imse.cnm.esJ. Paulo Teixeira ¨C Program ChairIST, Tech. Univ. Lisbon, INESC-IDR. Alves Redol, 91000-029 Lisboa, Portugal Tel.: +351-21 31 00 254Fax: +351-21 314 58 43E-mail: paulo.teixeira
ist.utl.ptVisit the ETS web page at: http://www.ieee-ets.org
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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