IMS 2009 - IMS 2009 IEEE International Microwave Symposium
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Website http://www.ims2009.org/cfp.html |
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Category IMS 2009
Deadline: December 08, 2008 | Date: June 07, 2009
Venue/Country: Boston, U.S.A
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
Steering CommitteeChairmanFred Schindlerm.schindlerieee.orgTechnical ProgramMark Goukermark.goukerieee.orgLawrence Kushnerkushnerieee.orgWorkshopsGregory Lyonsg.lyonsieee.orgShort CoursesRobert Jacksonjacksonecs.umass.eduInteractive ForumDan Swansond.swansonieee.orgPanel/Rump SessionsPhil Smithpmsmithieee.orgFocused/Special SessionsTim Hancockhancocktieee.orgPlenary SessionJohn Heatonjohnheatonieee.orgStudent CompetitionJim Komiakjkomiakieee.orgVirtual ParticipationCharlotte Blaircblairieee.orgPublicationsGeorge Heiterg.heiterieee.orgNick Koliasn.koliasieee.orgOperationsLuciano Boglionel.boglioneieee.orgFinanceBob Alongir.alongiieee.orgLocal ArrangementsTom Costastcostasieee.orgExhibition ManagementLee Woodleempassociates.comThe IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposium2009 (IMS 2009) will be held in Boston, Massachusetts, as the centerpiece of Microwave Week2009, scheduled from Sunday, 7 June through Friday, 12 June 2009. Technical papers describingoriginal work in research, development, and application of RF and microwave theory and techniquesare solicited, with typical technical areas listed below.MICROWAVE WEEK 2009: IMS opens on Monday evening with Plenary; technical sessionswill run from Tuesday through Thursday of Microwave Week. Workshops will be held on Sunday,Monday, Wednesday and Friday. In addition to IMS 2009, a microwave exhibition, a historicalexhibit, the RFIC Symposium (www.rfi c2009.org), and the ARFTG Conference (www.arftg.org)will also be held in Boston during Microwave Week 2009.PAPER SUBMISSION GUIDELINE: Technical papers for this symposium must be submittedvia the IMS 2009 website, www.ims2009.org. Complete information on how to submit a paperand register for the conference, as well as other important information, can be found at the IMS2009 website.PROPOSALS INVITED: Workshop (Tutorial through Expert level), Short Course, SpecialSession (Focused and Honorary), and Panel/Rump Session proposals are invited. Visit thefollowing links to suggest topics, or to volunteer to help organize or participate in an interactiveWorkshop (www.ims2009.org/Workshops.php), Short Course (www.ims2009.org/ShortCourses.php), Special Session (www.ims2009.org/SpecialSessions.php), or Panel Session (www.ims2009.org/PanelSessions.php).Proposals for workshops, short courses, panels, and special sessions: 19 September 2008Paper Submission: 8 December 2008Final Manuscript Submission: 20 March 2009All submissions must be made through the IMS 2009 portal: www.ims2009.orgALL SUBMISSIONS MUST BE MADE IN PDF FORMAT Hard copies not accepted.The authors are responsible for formatting. Font embedding must be IEEE Xplore compatible.Electronic Submission Deadlines1. Field Analysis and Guided Waves2. Frequency Domain Techniques3. Time Domain Techniques4. CAD Algorithms and Techniques5. Linear Device Modeling6. Nonlinear Device Modeling7. Nonlinear Circuit Analysis and System SimulationMicrowave Modeling Focus8. Transmission Line Elements9. Passive Circuit Elements10. Planar Passive Filters and Multiplexers11. Non-Planar Passive Filters and Multiplexers12. Active, Tunable and Integrated Filters13. Ferroelectric, Ferrite and Acoustic Wave Components14. MEMS Components and TechnologiesPassive Component FocusCall for Paperswww.ims2009.org15. Semiconductor Devices and Monolithic IC Technologies16. Signal Generation17. Frequency Conversion and Control18. HF/VHF/UHF Technologies and Applications19. Power Amplifier Devices and Integrated Circuits20. High-Power Amplifiers21. Low Noise Components and Receivers22. Millimeter Wave and Terahertz Components andTechnologiesActive Component Focus23. Microwave Photonics24. Signal Processing Circuits and Systems at GHz Speeds25. Packaging, Interconnects, MCMs and HybridManufacturing26. Instrumentation and Measurement Techniques27. Biological Effects and Medical Applications28. Smart Antennas, Spatial Power Combining and PhasedArrays29. Radars and Broadband Communication Systems30. Wireless and Cellular Communication Systems31. Sensors and Sensor SystemsMicrowave System FocusPaper Submission Instructions:1. Download the paper submission template from www.ims2009.org to view the suggested paper format.Authors are encouraged to adhere to the formatprovided in the template. The paper must be in PDFformat and the file size must be less than 1MB.2. Submit the paper at www.ims2009.org by 8 December2008. Late submissions will not be considered. Thesystem will accept up to four pages including text andfigures.3. Authors of accepted papers will be required to submit afinal paper for publication in the Symposium CDROM.Notice of paper acceptance and the necessaryinformation to electronically submit this final version ofthe paper will be sent to the authors in January 2009.Paper Selection Criteria: All submissions must be inEnglish. IMS 2009 Technical Program subcommitteeswill review the papers. The selection criteria willinclude the following factors:Originality: How is the contribution unique, significant,and state-of-the-art? Are references to previous work bythe authors and others included?Quantitative content: Does the paper give an explicitdescription of the work with complete supporting data?Clarity: Is the contribution clear? Are the writing andaccompanying figures clear and understandable?Interest to MTT-S membership: Why should this workbe reported at this conference?Technical Areas: Author-selected technical areas (seenext page) will be used to determine the appropriatereview committees. Choose a primary and an alternativearea when you complete the author registration form.The paper abstract should contain information that clearlyreflects the choice of area. The technical areas are categorizedin four focus areas or tracks. These focus trackswill be used in the organization of the paper presentationschedule at the symposium and are included herefor future reference. Note that it is permissible to choosea primary and an alternative technical area that are indifferent focus tracks. The IMS 2009 TPC may transferinappropriately placed papers into more appropriatesubcommittees.Presentation Format: The International MicrowaveSymposium offers three types of presentations:1. Full-Length Papers report significant contributions, advancements,or applications of microwave technologyin a formal presentation format with limited audienceinteraction.2. Short Papers typically report specific refinements or improvementsin the state-of-the-art in a formal presentationformat with limited audience interaction.3. Interactive Forum Papers provide an opportunity forauthors to present theoretical or experimental results ingreater detail in a poster format, and/or to display hardware,perform demonstrations, and conduct discussionsin an informal manner with interested colleagues.The author¡¯s preference will be honored where possible,but the paper will be placed in the most appropriate areaand presentation format consistent with the constraintsof the Technical Program. All presentations at IMS 2009will be given using electronic data projection. No 35-mmslide projectors or overhead transparency projectors willbe available.Student Paper Competition: A Student Paper Competitionwill be held as part of the Symposium. Studentpapers will be reviewed in the same manner as all otherconference papers. Papers accepted for the competitionwill be judged on content and presentation. First, second,and third prizes will be awarded. To be considered for anaward, the student must have been a full-time student(minimum 9 hours/term graduate, 12 hours/term undergraduate)during the time the work was performed, be thelead author, and must present the paper at the Symposium.During the paper submission process, the student isrequired to provide the e-mail address of the advisor, whowill be asked to certify that the work is primarily that of thestudent. Students may also elect to have their presentationsrecorded, as part of the IMS 2009 Virtual Participationprogram (see: www.ims2009.org/virtualparticipation.php). Recorded sessions will be viewable by all IMSattendees as well as virtual participants.Notification: Authors will be notified of the decision inJanuary 2009 via e-mail, using the address(es) providedduring the original paper submission. Authors of acceptedpapers will be referred to the website for forms anddetailed instructions for preparing manuscripts for publication.Final manuscripts must be received by 20 March2009, to be published on the CD-ROM and to qualify forpresentation at the Symposium.Clearances: It is the author¡¯s responsibility to obtain allrequired company and government clearances prior tosubmitting a paper. A statement certified by the submittingauthor that such clearances have been obtained anda completed IEEE copyright form must accompany thefinal manuscript of each accepted paper. Details regardingclearances will be available through the paper submissionwebsite (www.ims2009.org).Technical Paper SubmissionTechnical Areas8. Transmission Line ElementsPlanar, non-planar, and micromachined transmission linesand waveguides, including periodic and metamaterial-typestructures, discontinuities, junctions, and transitions.9. Passive Circuit ElementsCouplers, dividers/combiners, hybrids, resonators, lumped element approachesto circuit design.10. Planar Passive Filters and MultiplexersInnovative synthesis and analysis of (non-tunable) planar filters and multiplexers.Includes planar superconducting structures.11. Non-Planar Passive Filters and MultiplexersWaveguide, dielectric resonator, and non-planar superconducting structures.12. Active, Tunable and Integrated FiltersIntegrated filters (on Si, LTCC, LCP, MCM-D, GaAs, ¡?), active, tunable, andreconfigurable filters. Filters based on metamaterials, DGS, EBG, and otherstructures.13. Ferroelectric, Ferrite and Acoustic Wave ComponentsFerroelectric devices, bulk and thin film ferrite components,surface and bulk acoustic wave devices including FBAR devices.14. MEMS Components and TechnologiesRF microelectromechanical and micromachined componentsand subsystems: switches, resonators, tunable passive filters,phase shifters, reconfigurable filters, and antennas. Modeling,packaging, reliability, novel materials, and assembly processesPassive Component Focus1. Field Analysis and Guided WavesNovel guiding structures, new physical phenomena in transmission linesand other waveguiding structures, and new analytical methods for solvingguided-wave problems.2. Frequency Domain TechniquesFrequency Domain methods for numerical solution of electromagneticproblems, including field interactions with devices, circuits, and with otherphysical processes.3. Time Domain TechniquesTime Domain methods for numerical modeling of high frequency electronics,including modeling based on physical behaviors (electromagnetic,semiconductor, thermal, mechanical).4. CAD Algorithms and TechniquesCircuit analysis methods, optimization methods, statisticalanalysis.5. Linear Device ModelingLinear models of active and passive devices, models.6. Nonlinear Device ModelingLarge Signal device models, characterization, parameter extraction, validation.Power Amplifier modeling.7. Nonlinear Circuit Analysis and System SimulationHarmonic balance, simulation techniques, distortion and spurious analysis,system simulations, and behavioral modeling.Microwave Modeling Focus23. Microwave PhotonicsMicrowave/optical interactions and device technology. Wireless over fiber, freespaceoptical technology, broadband cableapplications of photonics, optical transmission effects.24. Signal Processing Circuits and Systems at GHz SpeedsHigh-speed mixed-signal components, modules and subsystems; ADC, DAC,and DDS; backplanes, signal integrity and equalization; electrical/opticalinterfaces and transmission; MIMO; SDR and cognitive systems.25. Packaging, Interconnects, MCMs and Hybrid ManufacturingDielectrics and substrates, component and subsystem packaging, assemblymethods, hybrid integration, interconnectsand multi-chip modules, hybrid manufacturing, yield and cost.26. Instrumentation and Measurement TechniquesNetwork, Time Domain, and spectral measurements, fieldmapping, error correction and estimation, materials measurements.27. Biological Effects and Medical ApplicationsBiomedical applications of microwaves, applications in biology,microwave fields and interactions in tissues.28. Smart Antennas, Spatial Power Combining and Phased ArraysSmart antennas for wireless applications, spatial power combining, phasedarrays, retrodirective systems, T/R modules,multiple-beam scanning, active integrated antennas.29. Radars and Broadband Communication SystemsBroadband and MMW communication systems for terrestrial,vehicular, satellite, and indoor applications. Radar systemsand subsystems. UWB systems and subsystems.30. Wireless and Cellular Communication SystemsWireless system and transceiver architectures for 3G/4G for cellular system,WLAN, UWB, WiMax, and Cognitive Radio Systems.31. Sensors and Sensor SystemsRFID, IVHS, wireless microsensors, nondestructive testing,imaging, andremote sensing.Microwave System Focus15. Semiconductor Devices and Monolithic IC TechnologiesMultifunction and monolithic integrated components: RF, microwave, andMillimeter Wave MMICs on GaAs, SiGe ICs, and other technologies. MMICmanufacturing, reliability, failure analysis, yield, and cost.16. Signal GenerationCW and pulsed oscillators, VCOs, DROs, YTOs, PLOs, and frequencysynthesizers. Applications of new devices and resonators, noise in oscillators,DDS techniques.17. Frequency Conversion and ControlElectronic switches, phase shifters, limiters, mixers, frequency multipliers, andfrequency dividers.18. HF/VHF/UHF Technologies and ApplicationsTechnology for HF, VHF, and UHF including passive and active components,lumped and distributed elements, transmitters and receivers.19. Power Amplifier Devices and Integrated CircuitsDesign and performance (with experimental data) of discrete and IC poweramplifiers for RF, microwave, and Millimeter Wave signals, wide bandgapdevices.20. High-Power AmplifiersHigh-power amplifier design and characterization, linearization techniques,power combining techniques, vacuum electronics.21. Low Noise Components and ReceiversLow-noise amplifiers, detectors, devices, receivers, radiometers, models, andcharacterization methods for low-noise circuits and components.22. Millimeter Wave and Terahertz Components and TechnologiesMillimeter Wave components, technologies, and applications above 30 GHz,submillimeter wave/terahertz devices, instruments, and applications includingTHz imaging.Active Component Focuswww.ims2009.orgAbout Boston, Massachusetts:Famous for everything from the Red Sox and Paul Revere to Cheers and seafood, Boston is a populardestination. Part history lesson, part modern metropolis, the Hub offers attractions to suit everyone. It is easyto get around, either on foot or by the user-friendly public transportation system. The Freedom Trail, one ofAmerica¡¯s first historic walking trails, will take you through 16 historical sites that span over two and a halfcenturies of America¡¯s past. Between landmarks, you can shop stores on Newbury Street, have an authenticItalian meal in the North End or browse the antique shops and distinctive red-brick buildings of Beacon Hill. Themore culturally inclined will not want to miss the city¡¯s world-class museums, theaters and music venues. Bostonis also home to a renowned aquarium, both a children¡¯s museum and science museum, along with the Museumof Fine Arts (MFA) and the Institute of Contemporary Art (ICA) whose groundbreaking exhibitions and engagingprograms, to state-of-the-art gallery space showcase not only outstanding art but innovative and exciting waysfor people to interact with the masterpieces. For additional information visit: www.bostonusa.com.IEEE Microwave Theory and Techniques Society (MTT-S):The IEEE MTT-S is a volunteer run, transnational society with more than 10,000 members and 120 chapters worldwide. Oursociety promotes the advancement of microwave theory and its applications, including RF, microwave, Millimeter Wave, andterahertz technologies.For more than 50 years the MTT-S has worked to advance the professional standing of its members and enhance thequality of life for all people through the development and application of microwave technology. As we enter into an excitingfuture our mission is to continue to understand and influence microwave technology. The activities sponsored by the MTT-Sinclude a broad spectrum of conferences, workshops, tutorials, technical committees, chapter meetings, publications andprofessional education programs. For additional information visit: www.mtt.org.The IEEE MTT-S International Microwave Symposium 2009 (IMS 2009) will be held in Boston, Massachusetts, Sunday, 7June through Friday, 12 June 2009. Technical papers describing original work in research, development, and application ofRF and microwave theory and techniques are solicited.Proposals for workshops, short courses, panels, and special sessions: 19 September 2008Paper Submission: 8 December 2008Final Manuscript Submission: 20 March 2009All submissions must be made through the IMS 2009 portal: www.ims2009.orgALL SUBMISSIONS MUST BE MADE IN PDF FORMAT Hard copies not accepted.The authors are responsible for formatting. Font embedding must be IEEE Xplore compatible.Electronic Submission Deadlines
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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