MOBISYS 2011 - 9th Annual International Conference on Mobile Systems, Applications and Services Mobisys 2011
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Website www.sigmobile.org/mobisys/2011/ |
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Category MOBISYS 2011
Deadline: December 11, 2010 | Date: June 28, 2011-July 01, 2011
Venue/Country: Washington, U.S.A
Updated: 2010-11-04 14:35:33 (GMT+9)
Call For Papers - CFP
The 9th Annual International Conference on Mobile Systems,Applications, and Services (MobiSys 2011)Sponsored by ACM SIGMOBILE and USENIXJune 28th - July 1st, 2011Washington, DC, USAhttp://www.sigmobile.org/mobisys/2011/
MobiSys 2011 will continue the tradition of publishing top-notch research papers dealing with all aspects of mobile systems. MobiSys seeks papers that take a broad systems perspective rather than focus narrowly on low-level components. The conference values results and insights obtained from working implementations more highly than those obtained solely from simulations. If you have any questions regarding relevance or other submission-related issues, please contact the program chairs at mobisys_pcchairs11
acm.org.Topics of interest include, but are not limited to:? Experience with mobile applications, networks and systems,? Innovative mobile and mobile sensing applications? Tools for building and measuring mobile systems,? Software architectures for mobile devices,? Infrastructure support for node mobility,? System-level energy management for mobile devices,? Data management for mobile applications,? Operating systems for mobile devices,? Support for mobile social networking and mobile Web,? Security and privacy in mobile systems,? Wearable computing and innovative mobile devices,? Systems for location and context sensing and awareness,? Mobile computing support for pervasive computing,? Vehicular wireless systems,? User interfaces and usability for mobile applications and systems,? Personal-area networks and systems,? Cyber foraging and resource discovery for mobile systemsPapers on work that is currently under review, whether in shorter, longer, or the same form, must not be submitted to MobiSys. Submission of a longer version of a published, not just accepted, workshop paper is encouraged if it includes significant new contributions. However, the authors must cite their workshop paper. Papers accompanied by nondisclosure agreement forms are not acceptable and will be returned to the author(s) unread. As is customary with the scientific peer review process, submissions will be handled as confidential material during the review process.Submissions should be full papers, up to 14 single-spaced 8.5" x 11" pages,including figures, tables, and references, in two-column format, using10-point type on 12-point (single-spaced) leading with 1" margins. Papersmay use the standard ACM template, available at:http://conferences.sigcomm.org/sigcomm/2009/sig-alternate-10pt.cls
.The first page of each paper should include the names and affiliations ofthe authors, i.e., the submissions should not be anonymous. Submissionswill be judged on originality, significance, interest, clarity, relevance,and technical correctness. Papers may be conditionally accepted andshepherded by a member of the program committee, with final acceptancedetermined by consent of the shepherd.For more submission guidelines, please visit the conference website.Important DatesPaper Abstract Registration: December 4th 2010 ? 9pm PSTPaper Submission Deadline: December 11th, 2010 ? 9pm PSTAcceptance Notification: March 7th, 2011Camera Ready Deadline: TBDThese are hard deadlines.No extensions will be granted.Organizing Committee:General ChairAshok Agrawala, University of Maryland, USASteering Committee ChairVictor Bahl, Microsoft Research Redmond, USAProgram Committee Co-ChairsMark D. Corner, UMass Amherst, USADavid Wetherall, U. of Wash. & Intel Labs, USAPosters/Demos ChairMoustafa Youssef, E-JUST, EgyptWorkshop Co-ChairsSami Rollins, University of San Francisco, USAAtif Memon, University of Maryland, USAWeb/Publicity ChairTamer Nadeem, Siemens Corporate Research, USALocal Arrangement ChairRichard Barnes, BBN, USAProgram CommitteeRajesh Balan, Singapore Management Univ., SingaporeAruna Balasubramanian, University of Washington, USASuman Banerjee, University of WisconsinGaetano Borriello, University of Washington, USAAndrew Campbell, Dartmouth College, USALandon Cox, Duke University, USASamir Das, Stony Brook University, USANigel Davies, Lancaster University, UKAdam Dunkels, SICS, SwedenMaria Ebling, IBM Research, USAMarco Gruteser, Winlab/Rutgers University, USAJason Hong, CMU, USAEdward Knightly, Rice University, USAEyal de Lara, University of Toronto, CanadaPhil Levis, Stanford University, USAZ. Morley Mao, University of Michigan, USAIqbal Mohomed, IBM Research, USAVenkat Padmanabhan, Microsoft Research, IndiaPablo Rodriguez, Telefonica, SpainChris Schmandt, MIT, USAJames Scott, Microsoft Research, Cambridge, UKAnmol Sheth, Intel Labs, Seattle, USARoy Want, Intel Labs, Santa Clara, USAAlec Wolman, Microsoft Research, Redmond, USALin Zhong, Rice University, USA
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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