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Category Circuits and Systems
Deadline: August 10, 2026 | Date: September 18, 2026-September 21, 2026
Venue/Country: Hangzhou, China
Updated: 2025-12-10 16:32:58 (GMT+9)
Venue: Hangzhou, ChinaDates: September 18-21, 20262026 8th International Conference on Circuits and Systems will take place in Hangzhou, China during September 18-21, 2026. ICCS 2026 is co-sponsored by Hangzhou International Innovation Institute of Beihang University, University of Electronic Science and Technology of China, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, hosted by State Key Laboratory of Spintronics/Yuhang Nano Center, and patroned by Fudan University (China), Auckland University of Technology(New Zealand), Zhejiang University (China), INAOE.[ Proceedings ]All papers submitted to ICCS that fall within its technical scope will be published in the Conference Proceedings, and at least one author of each accepted paper is expected to present at the conference.ICCS 2024 - ISBN: 979-8-3503-5214-6 | IEEE Xplore Online | Ei Compendex & Scopus indexICCS 2023 - ISBN: 979-8-3503-0827-3 | IEEE Xplore Online | Ei Compendex & Scopus indexICCS 2022 - ISBN: 978-1-6654-6036-1 | IEEE Xplore Online | Ei Compendex & Scopus indexICCS 2021 - ISBN: 978-1-6654-1233-9 | IEEE Xplore Online | Ei Compendex & Scopus indexICCS 2020 - ISBN: 978-1-7281-9121-8 | IEEE Xplore Online | Ei Compendex & Scopus indexICCS 2017 - ISBN: 978-1-5090-6480-9 | IEEE Xplore Online | EI Compendex & Scopus index=EI Journal=Selected papers after extension will be recommended to the following journal:Journal of SemiconductorsIndexing: Ei Compendex, ESCI, Scopus, INSPEC, CA, SA, AJ, CSTPCD, CSCD, WAJCI, etc. International Journal of Numerical Modelling: Electronic Networks, Devices and FieldsOnline ISSN:1099-1204Indexing: SCI, EI Compendex, Scopus, etcComputer Technology and Development (Monthly)ISSN: 1673-629XJournal of Electronic Science and TechnologyISSN: 1674-862XCitescore Track: 2.7Indexing: Ei Compendex, Scopus, INSPEC, CSCD, DOAJ etc., OA on ScienceDirect.[ Conference Awards ]Young Scientist AwardOutstanding Organization AwardBest Paper AwardBest Oral Presentation AwardBest Poster Presentation Award[ Special Session ]Chiplet-based Integrated SystemsOrganizers:Letian Huang, University of Electronic Science and Technology of ChinaXiaohang Wang, Zhejiang University[ Call for Papers ]Topics are interested but not limited to:Track 1: Analog and Nonlinear Circuits DesignComputing-in-Memory (CIM) and Analog AI AcceleratorsNonlinear Dynamics for Secure CommunicationsGeneral Analog CircuitsADCs /DACsPLL & Clock GeneratorsChaos and ApplicationsDynamic Nonlinear CircuitsTrack 2: VLSI Design & Electronic Design AutomaticHardware for AI/ML and Domain-Specific Accelerators3D/2.5D Heterogeneous Integration and Chiplet-based SystemsHardware Security: PUF, TRNG, and Side-Channel Attack CountermeasuresSystem Level Modeling & VerificationHigh Level SynthesisFormal VerificationHardware/Software Co-DesignApplication Driven Accelerators Design & Domain-Specific ProcessorFPGA based Design & Heterogynous SystemTrack 3: Circuits and Systems for Signal ProcessingCircuits and Systems for Edge AI and TinyMLBiomedical Signal Processing for Wearable/Implantable DevicesAdvanced Image Sensing and ProcessingCircuits and Systems for Image ProcessingCircuits and Systems for Audio & Video Analysis /Recognition/ ReconstructionBiomedical Image Processing SystemBody and Brain InterfacesCircuits and Systems for Radar Signal ProcessingCircuits and Systems for Signal DetectionTrack 4: RF & Communication CircuitsMillimeter-Wave and Terahertz (THz) Circuits for 6G/B5GIntegrated Silicon Photonics for Optical CommunicationOver-the-Air (OTA) Testing and Calibration of AiP ModulesAdvanced RF Building BlocksWireline Communication InterfacesWireless Transmitters, Receivers, and TransceiversCircuits and Systems for Equalization, Synchronization & Channel EstimationCircuits and Systems for Coding and ModulationTrack 5: Design for Test & ReliabilityTest and Reliability for AI Hardware and Secure ChipsAging Modeling and Mitigation in Advanced CMOS NodesSoC Test MethodologyAnalog & Mixed Signal Circuits TestFault Tolerant DesignAging Modeling & MitigationHardware SecurityTrack 6: Power Electronic CircuitsIntegrated Power Management and High-Efficiency ConvertersCircuits for Wireless Power Transfer and Energy HarvestingDistributed Circuits and SystemsPower Line Analyzing & ModelingEnergy Storage CircuitsEnergy Sources & Power ConverterCircuits and Systems for Smart GridTrack 7: Control Aspects of Circuits and SystemsControl and Navigation for Autonomous SystemsAdaptive and Learning-Based Control SystemsCircuits and Systems for Automated Driving & Automated VehicleCircuits and Systems for Motor ControlMechatronicsControl Theory Application in Circuits and SystemsAdaptive Circuits and SystemsTrack 8: Circuits and Systems for Instrumentation and MeasurementSmart Sensors and Sensor Fusion for IoTFiber-Optic Sensing for Infrastructure and Biomedical MonitoringDirect Sampling Time-Domain Measurement TechniquesSensors and Sensor InterfacesCircuits and Systems for InstrumentsCircuits and Systems for Fault Detection & DiagnosisCircuits and Systems for Data Acquisition & ConfusionCircuits and Systems for Measurement & Positioningmore details: https://iccs.org/cfp.html
[ Submission ]Make a submission via Easychair: https://easychair.org/my/conference?conf=iccs20260
more details:https://iccs.org/submission.html
[ Contact us ]Dr. Fidelia LeeE-mail: iccs
chairmen.orgKeywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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