CII 2011 - CII 2011 2011 IEEE Symposium on Computational Intelligence and Industry
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Category CII 2011
Deadline: October 31, 2010 | Date: April 11, 2011-April 15, 2011
Venue/Country: Paris, France
Updated: 2010-08-02 13:30:19 (GMT+9)
Call For Papers - CFP
CII 20112011 IEEE Symposium on Computational Intelligence and IndustryComputational Intelligence (CI) techniques have been widely and successfully applied to solve a variety of real-world problems in industry and defense. Nevertheless, several practical reasons do exist that prevent engineers from adopting most advanced CI techniques in their daily work. The main motivation of this symposium is to promote and strengthen the connections between academia, industry and government agencies through providing easily comprehensible tutorials, presenting successful application examples in industry and brain-storming discussions on how to make CI techniques to accessible to engineering and practitioners.TopicsTopics of the symposium include, but are not limited to:Industry-related research and development using CI techniques Application of CI techniques for solving complex real-world problems in industry Results from industry-financed CI research projectsResults from industry-led or industry-participated projects financed by government agencies and / or industryTechnology transfer issuesAssessment of the technology maturity level, e.g., using standards such as the Technology Readiness Levels (TRL’s) source: http://www.sei.cmu.edu/pub/documents/02.reports/pdf/02sr027.pdf
Analysis of CI related IP landscapeBest practicesIntegration of CI with traditional technologiesCommunication between industry, academia and governmentLarge CI research groups in industryGuidelines and research opportunities at NSF and other government agenciesLarge application-oriented CI research groups at academiaIEEE CIS supported activities that promote CI applications, including establishing CI related MSc program and summer schoolsSoftware and methodologies that enhance the accessibility of engineers to CI techniquesUser-friendly software for application CI techniquesTraining programs on CI related techniquesCI models lifecycle support: How do you support deployed CI models over time to prevent obsolescence? How do we enable others (maybe IT technicians) to do it?Symposium Co-ChairsYaochu Jin, University of Surrey, UK Piero P. Bonissone, GE Global Research, USAJennie Si, Arizona State University, USAProgram CommitteeAngelov Plamen, Lancaster University, UK Tao Ban, National Institute of Information and Communications Technology, Japan Piero Bonissone, General Electric Global Research, USA Pei-Chann Chang, Yuan Ze University, Taiwan, ROC Carlos A. Coello Coello, CINVESTAV-IPN, Mexico Fahmida N. Chowdhury, National Science Foundation, USA Dimitar P. Filev, Ford Research & Advanced Engineering, Dearborn, USA Gary Fogel, Natural Selection Inc., USA Michael Gienger, Honda Research Institute Europe, Germany Chi Keong Goh, Rolls-Royce Singapore Pte Ltd, Singapore Anthony (Tony) J. Grichnik, Caterpillar Inc., USA Robert Golan, DBmind Technologies Inc, USA Hani Hagras, University of Essex, UK Moufid Harb, Larus Technologies, Canada Xiao Hu, General Electronic Global Research, USA Yaochu Jin, Honda Research Institute, Germany Bob John, De Montfort University, UK Graham Kendall, University of Nottingham, UK Nikola Kasabov, Auckland University of Technology, New Zealand Arthur Kordon, Dow Chemical Company, USA Xuelong Li, Birkbeck College, University of London, UK Yan Liu, Motorola Labs, USA Zbigniew Michalewicz, University of Adelaide, Australia Luis Magdalena, European Centre for Soft Computing, Spain Yan Meng, Stevens Institute of Technology, USA Yi Lu Murphey, The University of Michigan-Dearborn, USA Hiroshi Nakajima, OMRON Corporation, Japan Detlef D Nauck, BT Innovate & Design, UK Tatsuya Okabe, Honda R&D, Japan Yew Soon Ong, Nanyang Technological University, Singapore Thomas E. Potok, Oak Ridge National Laboratory, USA Danil Prokhorov, Toyota Research Institute NA, USA Tapabrata Ray, University of New South Wales, Australia Thomas Runkler, Siemens AG, Germany Qiang Shen, Aberystwyth University, UK Jennie Si, Arizona State Uniersity, USA Joachim Sprave, Daimler AG, Germany Ke Tang, University of Science and Technology of China, China Hideyuki Takagi, Kyushu University, Japan Chuan-Kang Ting, National Chung Cheng University, Taiwan Vincenzo Loia, University of Salerno, Italy Dianhui (Justin) Wang, La Trobe University, Australia Slawo Wesolkowski, DRDC CORA, Canada Feng (Fred) Xue, General Electric Global Research, USA Ali M.S. Zalzala, Hikma Group Limited, UAE Qi Zhang, Tama University, Japan Yilu Zhang, General Motor Company, USA
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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