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    CII 2011 - CII 2011 2011 IEEE Symposium on Computational Intelligence and Industry

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    Website www.ieee-ssci.org | Want to Edit it Edit Freely

    Category CII 2011

    Deadline: October 31, 2010 | Date: April 11, 2011-April 15, 2011

    Venue/Country: Paris, France

    Updated: 2010-08-02 13:30:19 (GMT+9)

    Call For Papers - CFP

    CII 2011

    2011 IEEE Symposium on Computational Intelligence and Industry

    Computational Intelligence (CI) techniques have been widely and successfully applied to solve a variety of real-world problems in industry and defense. Nevertheless, several practical reasons do exist that prevent engineers from adopting most advanced CI techniques in their daily work. The main motivation of this symposium is to promote and strengthen the connections between academia, industry and government agencies through providing easily comprehensible tutorials, presenting successful application examples in industry and brain-storming discussions on how to make CI techniques to accessible to engineering and practitioners.

    Topics

    Topics of the symposium include, but are not limited to:

    Industry-related research and development using CI techniques

    Application of CI techniques for solving complex real-world problems in industry

    Results from industry-financed CI research projects

    Results from industry-led or industry-participated projects financed by government agencies and / or industry

    Technology transfer issues

    Assessment of the technology maturity level, e.g., using standards such as the Technology Readiness Levels (TRL’s) source: http://www.sei.cmu.edu/pub/documents/02.reports/pdf/02sr027.pdf

    Analysis of CI related IP landscape

    Best practices

    Integration of CI with traditional technologies

    Communication between industry, academia and government

    Large CI research groups in industry

    Guidelines and research opportunities at NSF and other government agencies

    Large application-oriented CI research groups at academia

    IEEE CIS supported activities that promote CI applications, including establishing CI related MSc program and summer schools

    Software and methodologies that enhance the accessibility of engineers to CI techniques

    User-friendly software for application CI techniques

    Training programs on CI related techniques

    CI models lifecycle support: How do you support deployed CI models over time to prevent obsolescence? How do we enable others (maybe IT technicians) to do it?

    Symposium Co-Chairs

    Yaochu Jin, University of Surrey, UK

    Piero P. Bonissone, GE Global Research, USA

    Jennie Si, Arizona State University, USA

    Program Committee

    Angelov Plamen, Lancaster University, UK

    Tao Ban, National Institute of Information and Communications Technology, Japan

    Piero Bonissone, General Electric Global Research, USA

    Pei-Chann Chang, Yuan Ze University, Taiwan, ROC

    Carlos A. Coello Coello, CINVESTAV-IPN, Mexico

    Fahmida N. Chowdhury, National Science Foundation, USA

    Dimitar P. Filev, Ford Research & Advanced Engineering, Dearborn, USA

    Gary Fogel, Natural Selection Inc., USA

    Michael Gienger, Honda Research Institute Europe, Germany

    Chi Keong Goh, Rolls-Royce Singapore Pte Ltd, Singapore

    Anthony (Tony) J. Grichnik, Caterpillar Inc., USA

    Robert Golan, DBmind Technologies Inc, USA

    Hani Hagras, University of Essex, UK

    Moufid Harb, Larus Technologies, Canada

    Xiao Hu, General Electronic Global Research, USA

    Yaochu Jin, Honda Research Institute, Germany

    Bob John, De Montfort University, UK

    Graham Kendall, University of Nottingham, UK

    Nikola Kasabov, Auckland University of Technology, New Zealand

    Arthur Kordon, Dow Chemical Company, USA

    Xuelong Li, Birkbeck College, University of London, UK

    Yan Liu, Motorola Labs, USA

    Zbigniew Michalewicz, University of Adelaide, Australia

    Luis Magdalena, European Centre for Soft Computing, Spain

    Yan Meng, Stevens Institute of Technology, USA

    Yi Lu Murphey, The University of Michigan-Dearborn, USA

    Hiroshi Nakajima, OMRON Corporation, Japan

    Detlef D Nauck, BT Innovate & Design, UK

    Tatsuya Okabe, Honda R&D, Japan

    Yew Soon Ong, Nanyang Technological University, Singapore

    Thomas E. Potok, Oak Ridge National Laboratory, USA

    Danil Prokhorov, Toyota Research Institute NA, USA

    Tapabrata Ray, University of New South Wales, Australia

    Thomas Runkler, Siemens AG, Germany

    Qiang Shen, Aberystwyth University, UK

    Jennie Si, Arizona State Uniersity, USA

    Joachim Sprave, Daimler AG, Germany

    Ke Tang, University of Science and Technology of China, China

    Hideyuki Takagi, Kyushu University, Japan

    Chuan-Kang Ting, National Chung Cheng University, Taiwan

    Vincenzo Loia, University of Salerno, Italy

    Dianhui (Justin) Wang, La Trobe University, Australia

    Slawo Wesolkowski, DRDC CORA, Canada

    Feng (Fred) Xue, General Electric Global Research, USA

    Ali M.S. Zalzala, Hikma Group Limited, UAE

    Qi Zhang, Tama University, Japan

    Yilu Zhang, General Motor Company, USA


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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