SCD 2011 - SCD 2011 : Semiconductor Conference Dresden

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Category SCD 2011

Deadline: March 01, 2011 | Date: September 27, 2011-September 28, 2011

Venue/Country: Dresden, Germany

Updated: 2011-01-28 18:06:49 (GMT+9)

Call For Papers - CFP

Mixed-signal, analogue and digital circuits and systems for high speed and/or low power consumption, adaptive power management, RF up to sub-THz, low costs, and advanced performance and density, circuits in More than Moore and Beyond Moore technologies.

Interconnection Technologies:

Wire bonding, flip chip (eutectic/lead-free solders), solder replacement flip chip (ICP, ACP, ACF, NCP), under bump metallurgy, high density substrates, microvia, build-up technologies, substrate metallurgy, embedded passives & actives, wafer/device level, MEMS, 3-D and novel interconnects.

Advanced System and Wafer Level Packaging:

New packaging technologies for single chip, multi-chip, wafer level, power and stacked-die packages addressing fine pitch, high I/O and performance issues, low loss interconnects and bonding techniques.

Optical Devices and Photonics:

Optical component assemblies, electro-optical modules, waveguides, silicon based photonic devices, organic devices.

Semiconductor Technologies, Materials and Processes:

CMOS, SiGe, More than Moore (silicon on insulator, strained silicon, multi-gate transistors) and Beyond Moore including carbon nano tubes, silicon nanowire, organic, polymer and ink-jet printed electronics, power devices (GaN, GaP), advances and application of adhesives, encapsulants, underfills, solder alloys, halogen-free materials, dielectrics, thin films, ceramics, composites, nano-materials, optical materials and characterization techniques, wafer (prime) production.

Assembly and Manufacturing Technologies:

Wafer bumping and thinning, process characterization, cost and cycle time reduction, etc..

Quality and Reliability:

Component, board and system level reliability assessment, failure analysis, interfacial adhesion, accelerated testing and

models, component and system qualification.

Modeling and Simulation:

EDA, TCAD, electrical, thermal, thermo-mechanical, reliability, optical, modeling and simulation for devices, component and system level applications.