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SOI 2010 - 2010 IEEE International SOI Conference
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Category SOI 2010
Deadline: June 04, 2010 | Date: October 11, 2010-October 14, 2010
Venue/Country: California, U.S.A
Updated: 2010-08-17 17:10:15 (GMT+9)
Call For Papers - CFP
Ever increasing demand and advances in SOI and related technologies make it essential to meet and discuss new gains and accomplishments in the field. For 35 years the IEEE International SOI Conference has been the premier meeting of engineers and scientists dedicated to current trends in Silicon-on-Insulator technology. Sponsored by the IEEE Electron Devices Society, the conference traditionally provides a forum for open discussion in all areas of SOI technologies and applications as well as the introduction of new developments presented in original papers presented at the technical sessions. SUBMISSION DEADLINE EXTENDED to6-JUNE-2010AREAS OF FOCUSDEVICE PHYSICS and MODELINGSUBSTRATE ENGINEERING (III-V advanced substrates, hybrid SI and III-V integration)NEW DEVICE / PHYSICS USING ADVANCED SUBSTRATES (III-V CMOS, hybrid SI and III-V)MANUFACTURABILITY and PROCESS INTEGRATION of SOI DEVICESLOW-POWER SOI TECHNOLOGY and CIRCUIT DESIGN INFRASTRUCTURESOI CIRCUIT APPLICATIONS (high-performance MPU, SRAM, ASIC, high-voltage, RF, analog, mixed mode, etc.)SOI DOUBLE and MULTIPLE GATE/VERTICAL CHANNEL STRUCTURES; OTHER NOVEL SOI STRUCTURESNEW SOI STRUCTURES, CIRCUITS, and APPLICATIONS (displays, microactuators, novel memories, optics, etc.)SOI RELIABILIITY ISSUES (hot-carrier effects, radiation effects, high-temperature effects, etc.)MATERIAL SCIENCE / MODIFICATION, SOI CHARACTERIZATION, MANUFACTURESOI SENSORs, MEMs, and RFIDs TECHNOLOGY and APPLICATIONS3D INTEGRATION (imagers, power devices, wafer-to-wafer and die to wafer 3D integration)SILICON or SOI PHOTONICSKeywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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