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Website https://ais.cn/u/3E7Rfi |
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Category Semiconductors;Communications;manufacturing;Sensor;Internet of Things
Deadline: April 20, 2026 | Date: May 08, 2026-May 10, 2026
Venue/Country: Shanghai, China
Updated: 2026-03-05 12:39:21 (GMT+9)
---Call For Papers---The topics of interest for submission include, but are not limited to:◕Semiconductor manufacturingExtreme ultraviolet lithography ( EUV ) technology3D integrated circuit and its manufacturing processAdvanced packaging and testing technology Semiconductor manufacturing process optimization and automation◕Quantum computation and quantum communicationQuantum dot and quantum bit control Quantum cryptography and secure communication Quantum Networks and the Internet Quantum computing hardware and chip design◕Semiconductor materials and devicesNew semiconductor materials ( such as silicon carbide, gallium nitride and two-dimensional materials ) Advanced CMOS Technology High efficiency power semiconductor devices Nanoscale electronic devices◕Sensor and MEMS technologyIntegrated micro-electro-mechanical system ( MEMS ) smart sensors and nano-sensorsBioelectronic equipment and sensing technologyEnvironmental Monitoring and Health Management Sensors◕Mobile communication technologyMobile Edge Computing ( MEC ) Network slicing technology Elastic network and adaptive communication Internet of Vehicles ( V2X ) technology◕Intelligent sensing and Internet of Things (IoT)Internet of Things node and gateway design Internet of things security and privacy Edge computing and edge intelligence Low Power Wide Area Network (LPWAN)◕Data processing and transmissionHigh speed data link technology Advanced coding and modulation technology Data compression and transmission optimization Fault tolerance and error correction technology---Publication---All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ICASC 2026 will be published in the SPIE - The International Society for Optical Engineering (ISSN: 0277-786X) Conference Proceedings, and it will be submitted to EI Compendex and Scopus for indexing.---Important Dates---Full Paper Submission Date: March 27, 2026Registration Deadline: April 3, 2026Final Paper Submission Date: April 20, 2026Conference Dates: May 8-10, 2026--- Paper Submission--- Please send the full paper(word+pdf) to Submission System: https://ais.cn/u/3E7Rfi
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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