Our Sponsors
ICICM 2026 - 11th International Conference on Integrated Circuits and Microsystems(ICICM 2026)
View: 12
Website http://icicm.net/ |
Edit Freely
Category Integrated Circuits and Microsystems
Deadline: September 15, 2025 | Date: October 23, 2026-October 25, 2026
Venue/Country: Xi'an, China
Updated: 2025-11-13 16:37:32 (GMT+9)
Call For Papers - CFP
★Full Name: 2026 The 11th International Conference on Integrated Circuits and Microsystems(ICICM 2026)★Abbreviation: ICICM 2026**Place: Xi'an, China**Time: October 23-25, 2026**Website: http://icicm.net/
★Co-Sponsored by==Xi'an Jiaotong University==Southeast University==University of Electronic Science and Technology of China★Hosted by==Xi'an Jiaotong University=Publication=Submitted papers will be Peer-Reviewed (Double Blind) and the accepted ones will be collected in the IEEE conference proceedings, included in IEEE Xplore and indexed by EI Compendex and Scopus.***ICICM 2016-2024 (previous 9 years) have been successfully indexed by EI Compendex and Scopus already!==Submission==1. Full Paper with at least 4 full pages (Presentation and Publication)Template Download in Word: https://www.icicm.net/files/Template.docTemplate Download in Latex: https://www.icicm.net/files/IEEE-conference-proceeding-Latex.rar2. Abstract within 300-500 words (Presentation only)*All manuscripts must be written in English.★ Electronic submission system: https://easychair.org/conferences/?conf=icicm2026★ Email submission: icicm_conf
vip.163.com More detail about submission, please visit at http://icicm.net/submission.html=Topics (include but not limit)=Track 1: Electronic Design Automation (EDA)• Progress of EDA algorithms• EDA for emerging technologies• Hardware-software co-design with EDA• EDA in High Performance Computing (HPC)• EDA in analog and mixed-signal designTrack 2: Integrated Circuit and System Design• Digital, analog, mixed-signal IC and SOC design technology• IC computer-aided design technology, DFM• Modeling and simulationTrack 3: Semiconductor Devices and Circuits• Components and circuits for wireless systems• Low power, RF devices and circuits• Silicon/Germanium Devices and Device Physics• Compound semiconductor devices and circuitsTrack 4: Process Technology and Manufacturing• Silicon integrated circuits and manufacturing• Interconnect, low-K, high-K and other process technologies• Packaging and testing technology, equipment technologyFor more topics, please visit at: http://icicm.net/call-for-papers.html==Organizing Committee==Conference ChairsZhigong Wang, Southeast University, ChinaXiulong Wu, Anhui University, ChinaKaixue Ma, Tianjin University, China Conference Co-ChairsNing Xu, Wuhan University of Technology, ChinaXiaoqing Wen, Kyushu Institute of Technology, Japan Qiang Li, University of Electronic Science and Technology of China, ChinaProgram ChairsAbdel-Hamid Ali Soliman, Staffordshire University, UKJun Han, Fudan University, ChinaXiaopeng Yu, Zhejiang University, ChinaMeng Zhang, Southeast University, ChinaSheng Chang, Wuhan University, ChinaYingmei Chen, Southeast University, China Zhikuang Cai, Nanjing University of Posts and Telecommunications, ChinaZhuo Zou, Fudan University, China (IEEE Senior Member)Jianguo Hu, Sun Yat-sen University , China Bei Yu, The Chinese University of Hong Kong , ChinaProgram Co-ChairsJunyong Deng, Xi'an University of Posts & Telecommunications, ChinaJun Xu, Nanjing University, ChinaZhixiong Di, Southwest Jiaotong University, ChinaGuojie Luo, Peking University, ChinaXiaojun Zhai, University of Essex, UKWei Xing, The University of Sheffield, UKProgram CommitteeBo Liu, Southeast University, China Shi Pu, Wuhan University of Technology , ChinaHaizhi Song, University Of Electronic Science And Technology Of China, ChinaLu Zhu, Sun Yat-sen University, ChinaYouming Zhang, Southeast University, ChinaJianshi Tang, Tsinghua University, ChinaWeiguang Sheng, Shanghai Jiao Tong University, ChinaHao Gao, Austria & Eindhoven University of Technology, The NetherlandYun Fang, Silicon Austria Labs, AustriaJeff Kilby, Auckland University of Technology, New ZealandZhijun Zhou, Southeast University, ChinaXingyuan Tong, Xi`an University Of Posts & Telecommunications, ChinaWei Hu, Northwestern Polytechnical University, ChinaZhaori Bi, Fudan University, ChinaZhengfeng Huang, Hefei University of Technology, ChinaLocal ChairLin Cheng, University of Science and Technology of ChinaStudent Program ChairsHongbin Sun, Xi'an Jiaotong University, ChinaKeping Wang, Tianjin University, China Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, ChinaFanyi Meng, Tianjin University, ChinaStudent Program Committee Li Du, Nanjing University, ChinaLei Wang, Nanjing University Of Posts And Telecommunications, China Xianbo Li, Sun Yat-sen University, ChinaTiehu Li, Chongqing University of Technology, ChinaMoufu Kong, University of Electronic Science and Technology of China, China Jiaxin Liu, University of Electronic Science and Technology of China, ChinaMaliang Liu, Xidian University, ChinaXu Meng, Hefei University of Technology, China Tianming Ni, Anhui University of Engineering, ChinaQiang Zhao, Anhui University, ChinaMore Organizing Committee list, please visit: https://icicm.net/committee.html==History==ICICM2016 | Chengdu on November 23-25, 2016ICICM2017 | Nanjing on November 8-11, 2017ICICM2018 | Shanghai on November 24-26, 2018ICICM2019 | Beijing on October 25-27,2019ICICM2020 | Nanjing on October 23-25, 2020ICICM2021 | Nanjing on October 22-24, 2021ICICM2022 | Xi'an on October 28-31, 2022ICICM2023 | Nanjing on October 20-23, 2023ICICM2024 | Wuhan on October 25-27, 2024ICICM2025 | Hefei on October 17-19, 2025=Contact us=Ms. Carrie LimEmail: icicm_confvip.163.com Web: http://icicm.net/Tel: (86)134-0855-5552Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.