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    TILE-TEC 2026 - 4th UK-China Teaching, Learning, and Educational Technology(TILE-TEC) Conference

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    Website https://tile-tec.org/ | Want to Edit it Edit Freely

    Category Teaching, Learning, and Educational Technology

    Deadline: March 22, 2026 | Date: May 22, 2026-May 24, 2026

    Venue/Country: Chengdu, China

    Updated: 2026-02-03 18:07:46 (GMT+9)

    Call For Papers - CFP

    The 4th UK-China Teaching, Learning, and Educational Technology(TILE-TEC) Conference

    Chengdu, China

    May 22-24, 2026

    About Conference

    Theme: Generative AI for Innovation, Sustainability, and Human-Centred Transformation in Transnational Education

    The 4th UK–China Teaching, Learning, and Educational Technology (TILE-TEC 2026) Conference will be held in Chengdu, China, from 22–24 May 2026. The conference aims to bring together academics, researchers, educators, educational developers, students, and industry professionals from the UK, China, and beyond to explore the transformative role of Generative Artificial Intelligence (GenAI) in higher education, with particular emphasis on Transnational Education (TNE).

    Conference Publication

    Accepted papers that meet the conference proceedings' requirements will be invited for either oral or poster presentation, and will be included in the conference proceedings.

    Accepted papers that do not meet conference proceeding's requirements will be scheduled exclusively for oral or poster presentation without publication.

    Conference Committee

    General Chairs

    Ce Zhu, University of Electronic Science and Technology of China, China

    Wasim Ahmad, University of Glasgow, UK

    Programme Chairs

    Mark Edwards, TNE Institute, UK

    Rebecca Wakelin, Xi'an Jiaotong-Liverpool University, China

    Technical Program Committee Chairs

    Haimeng Huang, University of Electronic Science and Technology of China, China

    Masood Ur Rehman, University of Glasgow, UK

    Call for Papers

    1. Generative AI in Teaching, Learning, and Curriculum Design

    2. AI-Enabled Assessment, Feedback, and Academic Integrity

    3. Student Engagement, Personalisation, and Learning Analytics

    4. Ethics, Trust, and Data Privacy in AI-Powered Education

    5. Human-Centred and Sustainable Education in the AI Era

    6. Student Support, Wellbeing, and Employability in AI-Driven TNE

    7. Redefining the Role of Educators and Academic Leadership

    8. Industry 5.0, Innovation, and Entrepreneurship Education

    9. Blended, Hybrid, and Immersive Learning Technologies

    Submission Guideline

    Full Paper (Presentation and Publication)

    1) The paper must be written in English.

    2) All submissions will undergo a peer-review process by the conference committee.

    3) The paper should be at least 2 pages, maximum 5 pages including all figures, tables, and references, more pages will be charged.

    4) The paper should be submitted as a PDF document in .pdf format.

    5) Submitted paper must be unpublished.

    6) Download the full paper template through:

    https://tile-tec.org/sub.html

    Abstract (Presentation ONLY)

    1) Abstracts will be considered for presentation (oral/poster) only without publication.

    2) The abstract must be written in English.

    3) Abstracts should be no more than 300 words and clearly outline the title, purpose, methods, and outcomes of the research or practice being described.

    4) All submissions will undergo a peer-review process by the conference committee.

    5) Download the abstract template through:

    https://tile-tec.org/sub.html

    Submission System

    Full paper

    Click the following website to submit your full paper: https://easychair.org/conferences/?conf=tiletec2026

    Abstract

    Click the following website to submit your abstract: https://iconf.young.ac.cn/m67XC

    Contact Us

    Conference Secretary: Ms. Lorna Ren

    Conference Email: tile-tecatyoungac.cn

    Conference Tel.: +86-19182240053


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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