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Website http://icmee.org/ |
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Category Mechanical;Electronics Engineering
Deadline: March 20, 2020 | Date: May 10, 2020-May 12, 2020
Venue/Country: Osaka, Japan
Updated: 2020-03-09 12:23:31 (GMT+9)
outlook.com 2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2020
{ Conference Scope }The works that will be presented and published at conference will focus on, but are not limited to, the following topics:Mechanical EngineeringAcoustics and Noise Control Marine System DesignAerodynamics Material EngineeringApplied Mechanics Material Science and ProcessingAutomation, Mechatronics and Robotics Mechanical DesignAutomobiles Mechanical Power EngineeringAutomotive Engineering MechatronicsBallistics MEMS and Nano TechnologyBiomechanics Multibody DynamicsBiomedical Engineering Nanomaterial EngineeringCAD/CAM/CIM New and Renewable EnergyCFD Noise and VibrationComposite and Smart Materials Noise ControlCompressible Flows Non-destructive EvaluationComputational Mechanics Nonlinear DynamicsComputational Techniques Oil and Gas ExplorationDynamics and Vibration Operations ManagementEnergy Engineering and Management PC guided design and manufactureEngineering Materials Plasticity Mechanics{ Venue }Osaka Convention Center, Osaka, JapanAdd: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN{ Contact }Ms. Serene Loicmee
outlook.com +86-028-83208181Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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