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ICMEE 2020 - IEEE--2020 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2020)--Ei Compendex, Scopus

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Category Mechanical;Electronics Engineering

Deadline: March 20, 2020 | Date: May 10, 2020-May 12, 2020

Venue/Country: Osaka, Japan

Updated: 2020-03-09 12:23:31 (GMT+9)

Call For Papers - CFP

IEEE--2020 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2020)--Ei Compendex, Scopus

2020 The 6th International Conference on Mechanical and Electronics Engineering is to be held in (Osaka Convention Center, Osaka, Japan) during (May 10-12, 2020)-

ICMEE 2020 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.

Accepted papers can be published in * ICMEE proceedings* and made available through IEEE Xplore. Proceedings will be submitted for inclusion in leading indexing services, including , etc

{ History }

The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6

The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6

The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6

The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6

The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31

{ Submission Method }

1. Send your manuscript directly to conference official email:

2. Submit your paper through easychair system:

{ Conference Scope }

The works that will be presented and published at conference will focus on, but are not limited to, the following topics:

Mechanical Engineering

Acoustics and Noise Control Marine System Design

Aerodynamics Material Engineering

Applied Mechanics Material Science and Processing

Automation, Mechatronics and Robotics Mechanical Design

Automobiles Mechanical Power Engineering

Automotive Engineering Mechatronics

Ballistics MEMS and Nano Technology

Biomechanics Multibody Dynamics

Biomedical Engineering Nanomaterial Engineering

CAD/CAM/CIM New and Renewable Energy

CFD Noise and Vibration

Composite and Smart Materials Noise Control

Compressible Flows Non-destructive Evaluation

Computational Mechanics Nonlinear Dynamics

Computational Techniques Oil and Gas Exploration

Dynamics and Vibration Operations Management

Energy Engineering and Management PC guided design and manufacture

Engineering Materials Plasticity Mechanics

{ Venue }

Osaka Convention Center, Osaka, Japan

Add: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN

{ Contact }

Ms. Serene Lo


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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