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    ICMEE 2020 - IEEE--2020 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2020)--Ei Compendex, Scopus

    View: 759

    Website http://icmee.org/ | Want to Edit it Edit Freely

    Category Mechanical;Electronics Engineering

    Deadline: March 20, 2020 | Date: May 10, 2020-May 12, 2020

    Venue/Country: Osaka, Japan

    Updated: 2020-03-09 12:23:31 (GMT+9)

    Call For Papers - CFP

    IEEE--2020 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2020)--Ei Compendex, Scopus

    2020 The 6th International Conference on Mechanical and Electronics Engineering is to be held in (Osaka Convention Center, Osaka, Japan) during (May 10-12, 2020)-

    ICMEE 2020 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.

    Accepted papers can be published in * ICMEE proceedings* and made available through IEEE Xplore. Proceedings will be submitted for inclusion in leading indexing services, including , etc

    { History }

    The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6

    The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6

    The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6

    The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6

    The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31

    { Submission Method }

    1. Send your manuscript directly to conference official email: icmeeatoutlook.com

    2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2020

    { Conference Scope }

    The works that will be presented and published at conference will focus on, but are not limited to, the following topics:

    Mechanical Engineering

    Acoustics and Noise Control Marine System Design

    Aerodynamics Material Engineering

    Applied Mechanics Material Science and Processing

    Automation, Mechatronics and Robotics Mechanical Design

    Automobiles Mechanical Power Engineering

    Automotive Engineering Mechatronics

    Ballistics MEMS and Nano Technology

    Biomechanics Multibody Dynamics

    Biomedical Engineering Nanomaterial Engineering

    CAD/CAM/CIM New and Renewable Energy

    CFD Noise and Vibration

    Composite and Smart Materials Noise Control

    Compressible Flows Non-destructive Evaluation

    Computational Mechanics Nonlinear Dynamics

    Computational Techniques Oil and Gas Exploration

    Dynamics and Vibration Operations Management

    Energy Engineering and Management PC guided design and manufacture

    Engineering Materials Plasticity Mechanics

    { Venue }

    Osaka Convention Center, Osaka, Japan

    Add: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN

    { Contact }

    Ms. Serene Lo

    icmeeatoutlook.com

    +86-028-83208181


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.