BDAI 2026 - 9th International Conference on Big Data and Artificial Intelligence (BDAI 2026)
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Website https://www.bdai.net |
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Category Big Data and Artificial Intelligence
Deadline: May 25, 2026 | Date: July 03, 2026-July 05, 2026
Venue/Country: Chongqing, China
Updated: 2025-09-17 17:35:46 (GMT+9)
Call For Papers - CFP
Full Name: 2026 9th International Conference on Big Data and Artificial Intelligence (BDAI 2026)Abbreviation: BDAI 2026July 3-5, 2026Chongqing University of Science and Technology, Chongqing, ChinaOfficial Website: www.bdai.netThe 9th International Conference on Big Data and Artificial Intelligence (BDAI2026) will be held at Chongqing University of Science and Technology, Chongqing, China during July 3-5, 2026. The conference is sponsored by Chongqing University of Science and Technology, Chongqing, China, IEEE, Xi 'an Jiaotong-Liverpool University, Taicang, China; Co-sponsored by Ocean University of China, China Agricultural University and South China University of Technology.The aim of BDAI2026 is to present the latest research and results of scientists related to Big Data and Artificial Intelligence topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field. We sincerely welcome the submissions all over the world.All the registered and presented papers will be published in Conference Proceedings by IEEE; Conference contents will be submitted for inclusion into Ei Compendex and Scopus.Conference HistoryBDAI2025 was successfully held at Xi 'an Jiaotong-Liverpool University, Taicang, China during August 22-24, 2025. IEEE ISBN: 979-8-3503-9251-7BDAI2024 was successfully held at North China University of Technology, Beijing during July 5-7, 2024! IEEE ISBN: 979-8-3503-5199-6BDAI2023 was successfully held in Haining, Zhejiang, China during July 7-9, 2023! IEEE ISBN: 979-8-3503-0365-0BDAI2022 was successfully held through virtual conference during July 8-10, 2022! IEEE ISBN: 978-1-6654-7080-3 BDAI2021 was successfully held through virtual conference during July 2-4, 2021! IEEE ISBN: 978-1-6654-1270-4BDAI2020 was successfully held through virtual conference during July 3-6, 2020! ACM ISBN: 978-1-4503-7560-3BDAI2019 was successfully held in Guangzhou, China during June 22-24, 2019! ACM ISBN: 978-1-4503-7185-8BDAI2018 was successfully held in Beijing, China during June 22-24, 2018! IEEE ISBN: 978-1-5386-6136-9Submissions MethodsMuch attention should be paid to write your paper according to the publication's request and submit the paper at: bdai2018
vip.163.comor you could log in Easychair.ORG-BDAI2026 page to submit the paper (linkage presented in website)BDAI 2026 is eager to collaborate with the specialists and entrepreneurs in the related field, we are willing to provide any form of collaboration by this platform.No matter you are an influencer in calling special sessions, or you are an excellent panel host, we are extremely pleased to listen to your inspiration and proposal.For any inquiry about the conference, please feel free to contact:Ms. Ashley LiuEmail: bdai2018
vip.163.comTelephone: +86-13980894300 (China)
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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