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    MIXDES 2011 - 2011 MIXDES - 18th International Conference "Mixed Design of Integrated Circuits & Systems"

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    Website www.mixdes.org | Want to Edit it Edit Freely

    Category MIXDES 2011

    Deadline: February 28, 2011 | Date: June 16, 2011-June 18, 2011

    Venue/Country: Gliwice, Poland

    Updated: 2010-09-28 20:16:11 (GMT+9)

    Call For Papers - CFP

    The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to continue the tradition of inviting you to the most attractive places in Poland and the will take place in Gliwice.

    The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices.

    The MIXDES conference papers are indexed in Thomson Reuters Conference Proceedings Citation Index and available in IEEE Xplore since MIXDES 2005.

    The topics of the MIXDES 2011 Conference include:

    1. Design of Integrated Circuits and Microsystems

    Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.

    2. Thermal Issues in Microelectronics

    Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.

    3. Analysis and Modelling of ICs and Microsystems

    Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.

    4. Microelectronics Technology and Packaging

    New microelectronic technologies. Packaging. Sensors and actuators.

    5. Testing and Reliability

    Design for testability and manufacturability. Measurement instruments and techniques.

    6. Power Electronics

    Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.

    7. Signal Processing

    Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.

    8. Embedded Systems

    Design, verification and applications.

    9. Medical Applications

    Medical and biotechnology applications. Thermography in medicine.

    10. Student Projects

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.