AEMCSE 2021 - 【IEEE Xplore、EI、Scopus】2021 4th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2021)
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Category (I) Computers Engineering;(II) Software Engineering;(III) Advanced Electronic Materials
Deadline: March 15, 2021 | Date: March 26, 2021-March 28, 2021
Venue/Country: Changsha, China, China
Updated: 2021-03-15 13:00:03 (GMT+9)
Call For Papers - CFP
【IEEE Xplore、EI、Scopus】2021 4th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2021)Website URL:http://aemcse.org Start Date / End Date: March 26-28, 2021Location: Changsha, China Official Email:aemcse2021163.com**AEMCSE 2021 is listed in Xi’an University of Posts & Telecommunications, China! http://cs.xupt.edu.cn:81/xiyoucs/showarticle.asp?ArticleID=28311.About the conference:The 2021 4th International Conference on Advanced Electronic Materials, Computers and Software Engineering(AEMCSE 2021) will be held in Changsha, China during March 26-28, 2021.2.PublicationAll accepted papers of AEMCSE 2021 will be published in the conference proceedings by IEEE CS CPS (Conference Publishing Services), which will be submitted to IEEE Xplore, EI Compendex, Scopus for indexing.3.Important DatesNotification Date: 1-2 weeks after submissionConference Date:March 26-28, 20214.Call For PapersOther related topics (http://aemcse.org/a/Call_For_Papers/)(I) Computers EngineeringOperating SystemsQuantum Computing TheoryScientific ComputingComputer ProgrammingDatabase Management SystemsEvolutionary ComputationLogic ProgrammingMachine LearningSoftware EngineeringSymbolic MathematicsDigital Signal Processing (DSP)Advanced Adaptive Signal ProcessingComputer Vision & VRMultimedia & Human-computer InteractionAI & Neural NetworksCommunication Signal processingSP for Internet and Wireless Communications(II) Software EngineeringSoftware ArchitectureSoftware design methodSoftware testing technologyAutomated software design and synthesisComponent-based software engineeringComputer-supported collaborative workProgramming language and software engineeringComputer networkInformation and communication securityComputer Graphics and Human Machine InteractionMultimedia technology applicationArtificial intelligence and recognitionEmbedded software and applicationsAutomatic controlDistributed Computing and Grid ComputingCloud computing technologyStorage technologyBig data analysis and processing(III) Advanced Electronic MaterialsDielectric materialSemiconductor materialPiezoelectric and ferroelectric materialsConductive metals and their alloysMagnetic materialOptoelectronic materialsElectromagnetic shielding materials5.Contact UsMs. HuangQQ: 2152116918Wechat: 15819926753Tel: +86-15819926753Mr. ZhengQQ: 2556533101Wechat: 18420103136Tel: +86-18420103136
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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