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Category MEMS 2012
Deadline: September 13, 2011 | Date: January 29, 2012-February 02, 2012
Venue/Country: Paris, France
Updated: 2011-03-25 15:59:43 (GMT+9)
Design, simulation and analysis tools with experimental verification
Fabrication technologies and processes
Silicon and non-silicon materials
Electro-mechanical integration techniques
Assembly and packaging approaches
Metrology and operational evaluation techniques
System architecture
The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to:
Mechanical, thermal, and magnetic sensors and actuators, and system
Opto-mechanical microdevices and microsystems
Fluidic microcomponents and microsystems
Microdevices for data storage
Microdevices for biomedical engineering
Micro chemical analysis systems
Microdevices and systems for wireless communication
Microdevices for power supply and energy harvesting
Nano-electro-mechanical devices and systems
Scientific microinstruments
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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