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    TSP 2021 - 2021 44th International Conference on Telecommunications and Signal Processing (TSP) - IEEE R8 | IEEE Xplore® | SCOPUS

    View: 458

    Website http://tsp.vutbr.cz/ | Edit Freely

    Category Information Systems; Network Services; Network Technologies; Telecommunication Systems; Modelling, Simulation and Measurement; Analog Signal Processing; Audio, Speech and Language Processing; Biomedical Signal Processing; Digital Signal Processing; Image and Video Signal Processing; Bioimpedance; Fractional Calculus; 5G; 6G; IoT

    Deadline: April 20, 2021 | Date: July 26, 2021-July 28, 2021

    Venue/Country: Virtual Conference, Online

    Updated: 2021-03-31 21:58:34 (GMT+9)

    Call For Papers - CFP

    2021 44th International Conference on Telecommunications and Signal Processing (TSP - IEEE Conference Record #52935)

    July 26-28, 2021 (virtual conference)

    Web: http://tsp.vutbr.cz/

    • Deadline for Special Session and Workshop Proposals: April 20, 2021 (Extended Deadline)

    • Deadline for Full Paper Submissions: April 20, 2021 (Extended Deadline)

    Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society.

    The TSP 2021 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library - IEEE Conference Record #49548, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

    After the conference, the authors of about 40% of the highest rated papers will also be invited to submit the extended version for publishing in Special Journal Issues (papers to be published after significant extension and new review process):

    • Special Issue 'Selected Papers from the 2020 43rd and 2021 44th International Conference on Telecommunications and Signal Processing (TSP)' of Applied Sciences (ISSN 2076-3417), an international peer-reviewed open access journal on all aspects of applied natural sciences published by MDPI and indexed by Web of Science (CiteScore 2019 Scopus data: 2.4, which equals rank 85/299 (Q2) in 'General Engineering' and 233/460 in 'General Materials Science'; current Impact Factor: 2.474)

    • Special Issue 'Advances in Signal Processing Techniques for Ground Penetrating Radar Applications' of Remote Sensing (ISSN 2072-4292), an international peer-reviewed open access journal about the science and application of remote sensing technology published by MDPI and indexed by Web of Science (JCR category rank: 9/30 (Q2) in 'Remote Sensing';current Impact Factor: 4.509)

    • Special Issue 'Signal Processing Circuits and Systems for Smart Sensing Applications' of Sensors (ISSN 1424-8220), an international peer-reviewed open access journal on the science and technology of sensors published by MDPI and indexed by Web of Science (CiteScore (2019 Scopus data: 5.0; ranked 17/129 (Q1) in 'Physics and Astronomy: Instrumentation' and 147/670 (Q1) in 'Electrical and Electronic Engineering' and 70/300 (Q1) in 'Computer Science: Information Systems';current Impact Factor: 3.275)

    • International Journal of Advances in Telecommunications, Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen Zeitschriftenbibliothek, and Directory of Open Access Journals

    GENERAL INFORMATION:

    You are kindly invited to participate in the 2021 44th International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/ - IEEE Conference Record #52935), which will be organized online during July 26-28, 2021. The TSP Conference serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa.

    TOPICS:

    TSP 2021, driven by the theme 'The age of A.I.', has opened Calls for Workshop and Special Session Proposals and Full Paper Submissions with deadline set April 20, 2021 (Extended Deadline). We look forward to your innovative contributions in any of the following areas:

    AREA 1: Telecommunications

    1. Information Systems

    2. Network Services

    3. Network Technologies

    4. Telecommunication Systems

    5. Modelling, Simulation and Measurement

    AREA 2: Signal Processing

    6. Analog Signal Processing

    7. Audio, Speech and Language Processing

    8. Biomedical Signal Processing

    9. Digital Signal Processing

    10. Image and Video Signal Processing

    For more details, please visit the Conference website at http://tsp.vutbr.cz/?page_id=121 .

    WORKSHOPS AND SPECIAL SESSIONS:

    Prospective Organizers are invited to submit proposals for Workshops and Special Sessions held during the TSP 2021 Conference. The following Workshop was approved so far:

    • WS1: 5th International Workshop on Recent Advances in Biometrics and its Applications organized by Assoc. Prof. Dr. Larbi Boubchir and Prof. Boubaker Daachi (both from the LIASD – University of Paris 8, France)

    Organizing guidelines are available at http://tsp.vutbr.cz/?page_id=3492 .

    STUDENT BEST PAPER AWARD:

    In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of the papers, their presentations, and their technical excellence, the authors of the Best 5 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists of a Certificate of Appreciation.

    ORGANIZERS:

    The TSP 2021 is an IEEE technically co-sponsored conference organized in cooperation with eighteen universities:

    • Brno University of Technology, Department of Telecommunications, Brno, Czech Republic

    • Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary

    • Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic

    • Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey

    • Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey

    • Josip Juraj Strossmayer University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia

    • Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey

    • National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan

    • Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan

    • Slovak University of Technology in Bratislava, Institute of Multimedia Information and Communication Technologies, Bratislava, Slovak Republic

    • Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain

    • Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria

    • Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de Saint-Denis (LIASD), France

    • University “Politehnica” of Bucharest, Center for Advanced Research on New Materials, Products and Innovative Processes (“CAMPUS”)

    • University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia

    • University of Patras, Physics Department, Patras, Greece

    • VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic

    • West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland

    COMMITTEES:

    • Honorary Chair - Miloslav Filka, Brno University of Technology, Czech Republic – Full Professor, TSP Conference Founder

    • General Chair - Norbert Herencsár, Brno University of Technology, Czech Republic – IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior Member

    • Publications & Student Paper Contest Chair - Jiří Hošek, Brno University of Technology, Czech Republic – IEEE Member

    • Finance Chair - Nándor Mátrai, Asszisztencia Congress Bureau, Hungary – Managing Director

    • Registration Chair - Csilla Fülöp, Asszisztencia Congress Bureau, Hungary – Project Manager

    Steering Committee:

    • Francesco Benedetto, University of “Roma TRE”, Italy – Full Professor, IEEE Senior Member

    • Larbi Boubchir, Université Paris 8, France – Associate Professor, IEEE Senior Member

    • Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataró, Tecnocampus, Spain – Full Professor, Dean

    • Izzet Cem Göknar, Işik University, Turkey – Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full Professor, IEEE Life Fellow

    • Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST), Taiwan – Full Professor, IEEE Senior Member

    • Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor

    • Jaroslav Koton, Brno University of Technology, Czech Republic – Vice-dean for Research, IEEE Senior Member

    • Sridhar Krishnan, Ryerson University, Canada – Full Professor & Associate Dean, IEEE Senior Member

    • Mario Kušek, University of Zagreb, Croatia – IEEE Croatia Section Communications Chapter Chair, IEEE Member

    • Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior Member

    • Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE Senior Member

    • Jiří Mišurec, Brno University of Technology, Czech Republic – Full Professor, Department Chair

    • Ram M. Narayanan, The Pennsylvania State University, USA – Full Professor, IEEE Fellow

    • Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior Member

    • Serdar Özoguz, Istanbul Technical University, Turkey – Full Professor, Associate Chair

    • Jakub Pęksiński, West Pomeranian University of Technology, Poland

    • Hector Perez-Meana, National Polytechnic Institute, Mexico – Full Professor, IEEE Senior Member

    • Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full Professor, Dean, IEEE Senior Member

    • Costas Psychalinos, University of Patras, Greece – Full Professor, IEEE Senior Member

    • Markus Rupp, Vienna University of Technology, Austria – Full Professor, Dean, IEEE Fellow

    • Zdeněk Smékal, Brno University of Technology, Czech Republic – Full Professor, IEEE Senior Member

    • Attila Vidács, Budapest University of Technology and Economics, Hungary – Deputy Head of Department

    • Miroslav Vozňák, VŠB-Technical University of Ostrava, Czech Republic – Full Professor, Department Chair, IEEE Senior Member

    • Drago Žagar, Josip Juraj Strossmayer University of Osijek, Croatia – Full Professor, Dean, IEEE Senior Member

    IMPORTANT DATES:

    • Deadline for Special Session and Workshop Proposals: April 20, 2021 (Extended Deadline)

    • Deadline for Full Paper Submissions: April 20, 2021 (Extended Deadline)

    • Notification of Paper Acceptance: June 15, 2021

    • Final Paper Submission: June 30, 2021

    • Authors' Registration and Payment: June 15 - July 15, 2021

    • Virtual Conference: July 26-28, 2021

    CONTACTS:

    Web: http://tsp.vutbr.cz/

    E-mail: tsp@feec.vutbr.cz

    Follow us on:

    • Facebook: https://www.facebook.com/tspconf/

    • Twitter: https://twitter.com/tspconf/

    TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the conference.


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.