3DIC 2012 - IEEE International 3D System Integration Conference (3DIC)

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Category 3DIC 2012

Deadline: October 31, 2011 | Date: January 31, 2012-February 02, 2012

Venue/Country: Osaka, Japan

Updated: 2011-10-10 17:27:37 (GMT+9)

Call For Papers - CFP

January 31- February 2, 2012, Osaka, Japan

Call for Papers

http://www.3dic-conf.jp/callforpapers.html

The IEEE International 3D System Integration Conference (3DIC) will be held at the "Senri Life-Science Center" in Osaka, Japan in January 31-February 2, 2012. The deadline for abstract submission is October 31, 2011. Authors are asked to submit one-page text abstract with one-page of figures and drawings.

3DIC 2011 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:

3D Integration Technology. Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration (e.g. for MEMS, NEMS), capacitive coupling, inductive coupling, multilevel epitaxial growth, etc.

3D IC Circuits Technology. 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D biomedical circuits etc.

3D Applications. Imaging, memory, processors, communications, network-ing, wireless, biomedical, MEMS/NEMS etc.

3D Design and Test Methodology. 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.

2011 Conference Co-Chairs:

M. Koyanagi (Tohoku Univ.) koyanagibmi.niche.tohoku.ac.jp

Morihiro Kada (ASET) kadaaset.tokyoinfo.or.jp

Organizing Committee

Asia: M. Koyanagi (Tohoku Univ), M. Kada ( ASET)

USA: P. Franzon (NCSU), P. Garrou (MCNC)

Europe: P. Ramm (Fraunhofer EMFT- Munich), E. Beyne (IMEC)

Conference web site: www.3dic-conf.jp