TTP LTD MSF 2038 - 【TTP Ltd 出版社】【保证EI Compendex检索】【Scopus 检索】【Materials Science Forum ISSN: 1662-9752】材料.化工.生物.所有基础和应用方面

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Category 【保证CPCI检索】【快速SCOPUS检索】【TTP Ltd 出版社】【保证EI Compendex检索】【Scopus 检索】【Materials Science Forum ISSN: 1662-9752】材料.化工.生物.所有基础和应用方面

Deadline: August 22, 2038 | Date: August 25, 2038-August 27, 2038

Venue/Country: WUHAN, China

Updated: 2021-09-09 11:14:15 (GMT+9)

Call For Papers - CFP

ISSN print 0255-5476 ISSN cd 1662-9760 ISSN web 1662-9752

http://www.researchi.org/conf.html

Materials Science Forum

ISSN print 0255-5476 ISSN cd 1662-9760 ISSN web 1662-9752

Published By :Trans Tech Publications Ltd

Website：https://www.scientific.net/MSF/Details

索引/检索收录：EI Compendex（Conference Article）, Scopus , CPCI (ISI Web of Science, 即ISTP)

主题：材料.化工.生物.所有基础和应用方面

SCOPUS / Web of Science (SCIE/SSCI/AHCI) /EI Compendex/ SJR / PubMed

Journal list

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期刊：

SAGE Open ISSN 2158-2440

出版社：SAGE

检索收录：Scopus (Q2; SJR 0.357); Web of Science (SSCI, IF 1.356)

Education Sciences ISSN 2227-7102

出版社：MDPI

检索收录：Scopus (Q2/Q3; SJR 0.453); Web of Science (ESCI)

Social Sciences ISSN 2076-0760

出版社：MDPI

检索收录：Scopus (Q2; SJR 0.357); Web of Science (ESCI)

Technology in Society

出版社：Elsevier

检索收录：Scopus (Q2; SJR 0.566); Web of Science (SSCI; IF 2.414)

Advances in Electrical and Computer Engineering

ISSN: 1582-7445, e-ISSN: 1844-7600

检索收录：Scopus;Web of Science (SSCI; IF 2.414)

Computer Modeling in Engineering & Sciences

ISSN: 1526-1506

检索收录：EI Compendex. Scopus (Q2; SJR 0.566); Web of Science (SCI; IF 1.593)

Electronics

ISSN：2079-9292

检索收录：Scopus、SCIE

Electronics

ISSN: 2079-9292

检索收录：EI Compendex. Scopus; Web of Science (SCI)

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SCOPUS / Web of Science (SCIE/SSCI/AHCI) /EI Compendex/ SJR / PubMed

Journal list

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SCOPUS / Web of Science (SCIE/SSCI/AHCI) /EI Compendex/ SJR / PubMed Journals 期刊

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