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Website http://www.iccc.org/ |
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Category Computer and Communications
Deadline: November 05, 2026 | Date: December 11, 2026-December 14, 2026
Venue/Country: Chengdu, China
Updated: 2026-02-02 12:23:43 (GMT+9)
Co-sponsored by: Sichuan Institute of Electronics, IEEEHosted by: Youth Talent Work Committee (Sichuan Institute of Electronics)Co-Hosted by: Southwest Jiaotong University, China; University of Electronic Science and Technology of China, China; Sichuan University, China; Chengdu University of Technology, China; Chengdu University of Information Technology, China; etc.PublicationAll accepted papers will be published in the Conference Proceedings by IEEE, and sent to be reviewed by the IEEE Conference Publication Program for including in IEEE Xplore, Ei Compendex and Scopus index, like the past ICCCs.The papers of ICCC 2015 - ICCC 2024 were published in IEEE Conference Proceedings, and had been indexed by EI Compendex, Scopus alreadly.(http://www.iccc.org/publication.html
).The papers of ICCC 2025 was published in IEEE Conference Proceedings. The proceedings of ICCC 2025 will be indexed by EI Compendex, Scopus soon.Call for General PapersTrack 1: Integrated AI and CommunicationsTrack 2: AI for Sciences, Engineering, and TechnologiesTrack 3: Computer Architecture, Systems, and NetworkingTrack 4: Data and SoftwareTrack 5: Integrated Sensing and CommunicationsTrack 6: Applications and Emerging TechnologiesFor details about topics, please visit at http://www.iccc.org/cfp.html
Submission1. Full paper(publication and presentation)2. Abstract (presentation)For full paper, please upload it to the Electronic Submission System (.pdf) https://easychair.org/my/conference?conf=iccc20260
For abstract, please send it to iccc2015
vip.163.com. More detail about submission, please visit at http://www.iccc.org/sub.html
ContactMs. Cynthia H. MiaoWebtsite: www.iccc.orgEmail: iccc2015
vip.163.comTel: +86-130-8660-0000Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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