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    APED 2011 - 2011 2nd Asia-Pacific Conference on Power Electronics and Design (APED)

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    Website www.ier-institute.org/aped/ | Want to Edit it Edit Freely

    Category APED 2011

    Deadline: June 15, 2011 | Date: October 08, 2011-October 09, 2011

    Venue/Country: Ulan Bator, Mongolia

    Updated: 2010-11-26 12:11:23 (GMT+9)

    Call For Papers - CFP

    2011 2nd Asia-Pacific Conference on Power Electronics and Design

    APED 2011 - Ulan Bator ,Mongolia

    October 8-9, 2011

    Please submit Papers based on research / practical experience (Industry Track). Topics of interest include, but are not limited to:

    1.1. Technologies and Digital Circuits

    Emerging logic & memory technologies and applications,

    Device design, Low power low leakage circuits,

    Memory circuits, Cooling technologies, Battery

    technologies, Variation-tolerant design, Temperatureaware and reliable design

    1.2. Design Tools

    Energy simulation and estimation tools that operate at

    the circuit/gate level, RT level, behavioral level, and

    algorithmic level, Variation-aware design, Physical design and interconnects

    1.3. Logic and Microarchitecture Design

    Processor core design, Cache design, Logic and RTL

    design, Arithmetic and signal processing circuits,

    Encryption technologies, Asynchronous design

    1.4. System Design and Methodologies

    Microprocessor, DSP and embedded systems design,

    FPGA and ASIC designs , Emerging applications,

    Server thermal management, System level power

    management, Behavioral and system level design aids

    1.5. Analog, MEMS and Mixed Signal Electronics

    RF circuits, Wireless, MEMS circuits, AD/DA

    Converters, Mixed-signal circuits, DC-DC conversion

    1.6. Software Design and Optimization

    Power aware compiler and operating system design,

    Application level optimizations, Wireless and sensor networks


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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