SPI 2011 - 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI)
View: 2153
Website www.spi2011.unina.it |
Edit Freely
Category SPI 2011
Deadline: February 15, 2011 | Date: May 08, 2011-May 11, 2011
Venue/Country: Naples, Italy
Updated: 2010-11-30 13:46:07 (GMT+9)
Call For Papers - CFP
15th IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTSMay 8-11, 2011 - Conference Centre Federico II, Naples, ItalyDownload the pdf version here:DEADLINESPerspective Authors should submit a two- or four-page manuscript by February 15th, 2011Detailed instructions for paper submission are available at the conference website www.spi2011.unina.it Notification about acceptance will be given by March 31th, 2010.Accepted papers are reproduced in the Workshop proceedings.PRESENTATIONDuring the last fourteen years, the IEEE Workshop on Signal Propagation on Interconnects has been developed into a forum of exchange on the latest research and developments in the field of interconnect modeling, simulation and measurement at chip, board, and package level. The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation. In view of the last years success the committee is looking forward to the 15th IEEE Workshop on Signal Propagation on Interconnects where world class developers and researchers will share and discuss leading edge results in Naples, Italy. The symposium will include both oral and poster sessions. In addition, a number of prominent experts will be giving keynote lectures and tutorials on areas of emerging interest. The official language is English.TOPICSHigh-speed Interconnects Power Distribution NetworksElectronic packages and microsystems Optical InterconnectsRF, Microwave and Wireless Interconnects Nano-Interconnects and nano-PackagesElectromagnetic Theory and Modeling Transmission Line Theory and ModelingMacro-Modeling, reduced-order models Advanced Simulation Tools for Modeling Interconnects StructuresSignal Integrity on High-Speed Interconnects Power Integrity/ Ground NoiseAdvanced Simulation Tools for Modeling Interconnects Structures Electromagnetic CompatibilityCoupling Effects on Interconnects Radiation & Interference )Substrate Effects Testing & InterconnectsFrequency Domain Measurement Techniques Time Domain Measurement TechniquesWORKSHOP COMMITEESChairman:Antonio Maffucci, University of Cassino, DAEIMIProgram Chairs:Massimiliano D'Aquino, University of Naples ParthenopeGiovanni Miano, University of Naples Federico IIWorkshop Standing CommitteeUwe Arz, Physikalisch-Technische Bundesanstalt, Braunschweig (GER)Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, Torino (ITA)Hartmut Grabinski, Leibniz Univ. Hannover, LFI, Hannover (GER)Michel S. Nakhla, Carleton University, Department of Electronics, Ottawa (CAN) Jose E. Schutt-Aine>, Univ. of Illinois at Urbana-Champaign, ECE, Urbana (USA)Madhavan Swaminathan, Georgia Institute of Technology, Atlanta (USA)Local Organizing CommitteeAndrea G. Chiariello, University of Cassino Massimiliano de Magistris, University of Naples Federico II Guglielmo Rubinacci, University of Naples Federico II Antonello Tamburrino, University of Cassino Salvatore Ventre, University of Cassino Fabio Villone, University of Cassino SECRETARIATMariella Vetranoc/o Dipartimento di Ingegneria Elettrica,Via Claudio 21, I-80125 Napoli, ItalyTel: +39 081 7683243Fax +39 081 7683171m.vetrano
create.unina.it
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.