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    SPI 2011 - 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI)

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    Website www.spi2011.unina.it | Want to Edit it Edit Freely

    Category SPI 2011

    Deadline: February 15, 2011 | Date: May 08, 2011-May 11, 2011

    Venue/Country: Naples, Italy

    Updated: 2010-11-30 13:46:07 (GMT+9)

    Call For Papers - CFP

    15th IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS

    May 8-11, 2011 - Conference Centre Federico II, Naples, Italy

    Download the pdf version here:

    DEADLINES

    Perspective Authors should submit a two- or four-page manuscript by February 15th, 2011

    Detailed instructions for paper submission are available at the conference website www.spi2011.unina.it

    Notification about acceptance will be given by March 31th, 2010.

    Accepted papers are reproduced in the Workshop proceedings.

    PRESENTATION

    During the last fourteen years, the IEEE Workshop on Signal Propagation on Interconnects has been developed into a forum of exchange on the latest research and developments in the field of interconnect modeling, simulation and measurement at chip, board, and package level. The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation.

    In view of the last years success the committee is looking forward to the 15th IEEE Workshop on Signal Propagation on Interconnects where world class developers and researchers will share and discuss leading edge results in Naples, Italy.

    The symposium will include both oral and poster sessions. In addition, a number of prominent experts will be giving keynote lectures and tutorials on areas of emerging interest. The official language is English.

    TOPICS

    High-speed Interconnects Power Distribution Networks

    Electronic packages and microsystems Optical Interconnects

    RF, Microwave and Wireless Interconnects Nano-Interconnects and nano-Packages

    Electromagnetic Theory and Modeling Transmission Line Theory and Modeling

    Macro-Modeling, reduced-order models Advanced Simulation Tools for Modeling Interconnects Structures

    Signal Integrity on High-Speed Interconnects Power Integrity/ Ground Noise

    Advanced Simulation Tools for Modeling Interconnects Structures Electromagnetic Compatibility

    Coupling Effects on Interconnects Radiation & Interference )

    Substrate Effects Testing & Interconnects

    Frequency Domain Measurement Techniques Time Domain Measurement Techniques

    WORKSHOP COMMITEES

    Chairman:

    Antonio Maffucci, University of Cassino, DAEIMI

    Program Chairs:

    Massimiliano D'Aquino, University of Naples Parthenope

    Giovanni Miano, University of Naples Federico II

    Workshop Standing Committee

    Uwe Arz, Physikalisch-Technische Bundesanstalt, Braunschweig (GER)

    Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, Torino (ITA)

    Hartmut Grabinski, Leibniz Univ. Hannover, LFI, Hannover (GER)

    Michel S. Nakhla, Carleton University, Department of Electronics, Ottawa (CAN)

    Jose E. Schutt-Aine>, Univ. of Illinois at Urbana-Champaign, ECE, Urbana (USA)

    Madhavan Swaminathan, Georgia Institute of Technology, Atlanta (USA)

    Local Organizing Committee

    Andrea G. Chiariello, University of Cassino

    Massimiliano de Magistris, University of Naples Federico II

    Guglielmo Rubinacci, University of Naples Federico II

    Antonello Tamburrino, University of Cassino

    Salvatore Ventre, University of Cassino

    Fabio Villone, University of Cassino

    SECRETARIAT

    Mariella Vetrano

    c/o Dipartimento di Ingegneria Elettrica,

    Via Claudio 21, I-80125 Napoli, Italy

    Tel: +39 081 7683243

    Fax +39 081 7683171

    m.vetranoatcreate.unina.it


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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