ICICM 2023 - 8th International Conference on Integrated Circuits and Microsystems (ICICM 2023)

Website http://icicm.net/ | Edit Freely

Category Integrated Circuits and Microsystems

Deadline: September 10, 2023 | Date: October 20, 2023-October 23, 2023

Venue/Country: Nanjing, China

Updated: 2023-07-28 16:18:36 (GMT+9)

Call For Papers - CFP

★Abbreviation: ICICM 2023

**Place: Nanjing, China

**Time: October 20-23, 2023

**Website: http://icicm.net/

=Publication=

The accepted and registered papers will be publication in IEEE Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc.

***ICICM 2016-2022 has been successfully indexed by EI Compendex and Scopus already!

***ICICM 2023 has been listed in IEEE Offcial Event List.

==History==

ICICM2016 | Chengdu on November 23-25, 2016

ICICM2017 | Nanjing on November 8-11, 2017

ICICM2018 | Shanghai on November 24-26, 2018

ICICM2019 | Beijing on October 25-27,2019

ICICM2020 | Nanjing on October 23-25, 2020

ICICM2021 | Nanjing on October 22-24, 2021

ICICM2022 | Xi'an on October 28-31, 2022

★Co-Sponsored by:

==Southeast University, China

==University of Electronic Science and Technology of China, China

==Nanjing University of Posts and Telecommunications, China

==IEEE

==CAS

==Submission==

1. Full paper (publication and presentation)

2. Abstract (presentation only)

Electronic submission system: https://easychair.org/conferences/?conf=icicm2023

Email submission: icicm_confvip.163.com

More detail about submission, please visit at http://icicm.net/submission.html

=Topics (include but not limit)=

► Thz and Microwave MicroSystem

► Devices and Circuits for Wirless System

► Application Specific Circuits and Systems for Communication

► Digital, Analog, Mixed Signal IC and SOC design technology

► Silicon integrated circuits and manufacturing

► Low-power, RF devices & circuits

► IC Computer-Aided –Design technology, DFM

► Silicon/germanium devices and device physics

► Interconnect, Low K, High K and other process technologies

► Unconventional and nano-electronics

► Organic semiconductor devices and technologies

► Compound semiconductor devices and circuits

► Displays, sensors and MEMS

► Semiconductor materials and material characterization

► Packaging and testing technology

► Solar cell & other devices for new energy sources

► Modeling and simulation

► Equipment technology

► Reliability

► Displays, sensors and MEMS

► Advance memories technology

For more topics, please visit at: http://icicm.net/call-for-papers.html

==Organizing Committee==

**Advisory Chairs

Pui-in Mak, University of Macau, Macau, China

Ljiljana Trajkovic, Simon Fraser University, Canada

**Conference Chairs

Zhigong Wang, Southeast University, China

Chen Liu, Nanjing University of Posts and Telecommunica